Zobrazeno 1 - 10
of 97
pro vyhledávání: '"John E. Blendell"'
Autor:
Colin V. Greene, Ganesh Subbarayan, Yifan Wu, Raiyo Aspandiar, Nilesh Badwe, John E. Blendell, Carol A. Handwerker, Sukshitha Achar Puttur Lakshminarayana, Yaohui Fan, Travis F. Dale
Publikováno v:
Journal of Electronic Materials. 50:6615-6628
Low reflow temperature solder interconnect technology based on Sn-Bi alloys is currently being considered as an alternative for Sn-Ag-Cu solder alloys to form solder interconnects at significantly lower melting temperatures than required for Sn-Ag-Cu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2012887ba2cbbd03464dd80d2889a5b
https://doi.org/10.1007/s11664-021-09256-1
https://doi.org/10.1007/s11664-021-09256-1
Publikováno v:
Scripta Materialia. 187:458-463
Two grain boundaries (GBs) in a Sn-alloy film exhibited different morphological changes during thermal cycling: whisker growth and GB sliding. Along GB-I, pervasive nucleation of high-angle and low-angle GBs occurred, with whisker growth of some shal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb2a43e113ea7a81589dd1cf81ec6ccb
https://doi.org/10.1016/j.scriptamat.2020.06.033
https://doi.org/10.1016/j.scriptamat.2020.06.033
Publikováno v:
Acta Materialia. 192:1-10
Whisker and hillock formation are a stress relaxation response in Sn thin films and have become a critical reliability problem in Pb-free electronics. Whiskers grow by diffusion of atoms driven by stress gradients and usually have shallow grains at t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::672e1d77313e1d283bb4122c958d26d7
https://doi.org/10.1016/j.actamat.2020.03.014
https://doi.org/10.1016/j.actamat.2020.03.014
Publikováno v:
Acta materialia 191, 101-110 (2020). doi:10.1016/j.actamat.2020.03.055
The equilibrium crystal shape is a convex shape bound by the lowest energy interfaces. In many polycrystalline microstructures created by grain growth, the observed distribution of grain boundary planes appears to be dominated at low driving forces (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5f1d32a84af3f72db721292648c16265
https://juser.fz-juelich.de/record/887813
https://juser.fz-juelich.de/record/887813
Publikováno v:
Scripta materialia 178, 236-239 (2020). doi:10.1016/j.scriptamat.2019.11.034
The impact of faceting on grain growth was approached by model experiments in NiO–MgO. Grain growth rates were found to be 10 times higher in NiO compared to MgO. As the self-diffusion acoefficients differ by a factor of 250, grain growth in NiO is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7bfe63029dbab5bbc8a49fe8a2d5ed1a
https://juser.fz-juelich.de/record/887814
https://juser.fz-juelich.de/record/887814
Publikováno v:
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).
The ultimate success of low-temperature hybrid assembly in which high-Pb Sn-Ag-Cu ball grid array solder joints are assembled with a low melting temperature alloy will be determined by a range of thermodynamic, kinetic, and microstructure evolution e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08385a4b0cd3411e4820399d9b5f8adc
https://doi.org/10.23919/ltb-3d.2019.8735212
https://doi.org/10.23919/ltb-3d.2019.8735212
Publikováno v:
JOM. 68:2888-2899
Four different types of stress relaxation responses have been observed in terms of local microstructural changes along grain boundaries (GBs) in large-grained high-Sn (Sn-3.0Ag-0.5Cu) solder films after thermal cycling. The grain boundaries were char
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ae5242b4e46fce68d22caac971566cb
https://doi.org/10.1007/s11837-016-2070-3
https://doi.org/10.1007/s11837-016-2070-3
Publikováno v:
Journal of the American Ceramic Society. 99:1287-1293
(Ba,Ca)(Ti,Zr)O3 lead-free piezoelectric ceramics have been considered to be one of the most potential lead-free alternatives for PZT in the room-temperature range. The stability of the piezoelectric performance during unipolar cycling is investigate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f84035acc09f9821863f6fe2fa603d34
https://doi.org/10.1111/jace.14103
https://doi.org/10.1111/jace.14103
Publikováno v:
Applied Physics Letters
Applied Physics Letters, American Institute of Physics, 2020, 117 (1), pp.012902. ⟨10.1063/5.0012635⟩
Applied Physics Letters, American Institute of Physics, 2020, 117 (1), pp.012902. ⟨10.1063/5.0012635⟩
International audience; The first direct Barkhausen noise measurement in a ferroelectric thin film is presented. The Barkhausen noise energy loop is reconstructed from the measured Barkhausen noise and is closely related to the classic ferroelectric
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e2c85febd07c07c2f3cb29b2b2548f75
https://doi.org/10.1063/5.0012635
https://doi.org/10.1063/5.0012635