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pro vyhledávání: '"John Doricko"'
Autor:
John H. Lau, V. Kripesh, Yue Ying Ong, John Doricko, Jiangyan Sun, Nagarajan Ranganathan, Damaruganath Pinjala, Shiguo Liu, Xiaowu Zhang, Gongyue Tang, Tai Chong Chai, Eva Wai, C. J. Vath, Ebin Liao, Srinivasa Rao Vempati, C. S. Selvanayagam, Kalyan Biswas, Hongyu Li
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Because of Moore's (scaling/integration) law, the Cu/low-k silicon chip is getting bigger, the pin-out is getting higher, and the pitch is getting finer. Thus, the conventional organic buildup substrates cannot support these kinds of silicon chips an