Zobrazeno 1 - 10
of 13
pro vyhledávání: '"John, Yue"'
Autor:
John Yue, Nishanth Krishnan, John Kanter, Hansen Deng, David Okonkwo, Ava Puccio, Debbie Madhok, Patrick Belton, Britta Lindquist, Gabriela Satris, Young Lee, Gray Umbach, Ann-Christine Duhaime, Pratik Mukherjee, Esther Yuh, Alex Valadka, Anthony DiGiorgio, Phiroz Tarapore, Michael Huang, Geoffrey Manley, The Investigators
Publikováno v:
Journal of Clinical Medicine; Volume 12; Issue 5; Pages: 2024
Introduction: Neuroworsening may be a sign of progressive brain injury and is a factor for treatment of traumatic brain injury (TBI) in intensive care settings. The implications of neuroworsening for clinical management and long-term sequelae of TBI
Autor:
Hansen, Deng, Andrew, Chan, Simon, Ammanuel, Alvin, Chan, Taemin, Oh, Henry, Skrehot, Caleb, Edwards, Sravani, Kondapavulur, Amy, Nichols, Catherine, Liu, John, Yue, Sanjay, Dhall, Aaron, Clark, Dean, Chou, Christopher, Ames, Praveen, Mummaneni
Publikováno v:
Journal of neurosurgery. Spine. 32(2)
Surgical site infection (SSI) following spine surgery causes major morbidity and greatly impedes functional recovery. In the modern era of advanced operative techniques and improved perioperative care, SSI remains a problematic complication that may
Autor:
Soo, John Yue Han
Photometric redshifts (photo-z's) are vital for the success of current and forthcoming cosmological galaxy surveys. This work focuses on three different approaches to enhance photo-z's. Firstly, we study the extent to which galaxy morphology improves
Externí odkaz:
https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.756296
Autor:
D. Herner, J. Van Gogh, P. Chakravarthy, Yoichiro Tanaka, John Yue Zhang, A. Mak, Gongda Yao, L. Buckley, S. Ghanayem, Hou Gong Wang
Publikováno v:
1998 5th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.98EX105).
Chemical vapor deposition of tungsten (W) and physical vapor deposition of Ti/TiN was optimized to provide a minimum thickness TiN barrier while maintaining protection of Ti underlayer to prevent reaction with gases and W used in the CVD process. Imp
Autor:
Tanaka, Y., Gongda Yao, Van Gogh, J., Herner, D., John Yue Zhang, Hou Gong Wang, Buckley, L., Chakravarthy, P., Mak, A., Ghanayem, S.
Publikováno v:
1998 5th International Conference on Solid-State & Integrated Circuit Technology Proceedings (Cat No98EX105); 1998, p207-210, 4p
Conference
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Autor:
John Yue, Satris, Gabriela, Winkler, Ethan, Robinson, Caitlin, Upadhyayula, Pavan, Lingsma, Hester, Korley, Frederick, Nielson, Jessica, Ngwenya, Laura, Ferguson, Adam, Vassar, Mary, Yuh, Esther, Mukherjee, Pratik, Gordon, Wayne, Valadka, Alex, David, Geoffrey Manley
Publikováno v:
Journal of Neurotrauma; 7/1/2016, Vol. 33 Issue 13, pA-37-A-37, 1/3p
Autor:
John Yue, Winkler, Ethan, Esther Yuh, Korley, Frederick, Lingsma, Hester, Pirracchio, Romain, Burke, John, Satris, Gabriela, Robinson, Caitlin, Upadhyayula, Pavan, Ngwenya, Laura, Ferguson, Adam, Vassar, Mary, Mukherjee, Pratik, Gordon, Wayne, Valadka, Alex, Okonkwo, David, Manley, Geoffrey
Publikováno v:
Journal of Neurotrauma; 7/1/2016, Vol. 33 Issue 13, pA-15-A-15, 1/3p
Conference
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Conference
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