Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Johee Won"'
Autor:
Hirokuni Hiyama, Taesung Kim, Satomi Hamada, Nilam Qureshi, Juhwan Kim, Johee Won, Yutaka Wada, Seokjun Hong, Seung-Ki Chae
Publikováno v:
ECS Journal of Solid State Science and Technology. 8:P430-P436
This study details the improved ceria abrasive removal on SiO2 wafer during the post CMP water polishing (buff clean) process. Initially, the zeta potentials of the wafer and ceria abrasive were measured according to pH and compared with the zeta pot
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4cf67564127e69c4f763197ed6abd0d
https://doi.org/10.1149/2.0171908jss
https://doi.org/10.1149/2.0171908jss
