Zobrazeno 1 - 10
of 40
pro vyhledávání: '"Johannes Zechner"'
Autor:
Curran Kalha, Pardeep K. Thakur, Tien‐Lin Lee, Michael Reisinger, Johannes Zechner, Michael Nelhiebel, Anna Regoutz
Publikováno v:
Advanced Physics Research, Vol 2, Iss 12, Pp n/a-n/a (2023)
Abstract Interdiffusion phenomena between adjacent materials are highly prevalent in semiconductor device architectures and can present a major reliability challenge for the industry. To fully capture these phenomena, experimental approaches must go
Externí odkaz:
https://doaj.org/article/7f17476282a048c38856a20aaca86a52
Autor:
Markus Alfreider, Glenn Balbus, Fulin Wang, Johannes Zechner, Daniel S. Gianola, Daniel Kiener
Publikováno v:
Materials & Design, Vol 223, Iss , Pp 111136- (2022)
A wide variety of today’s engineering material systems consist of multiple layered constituents to satisfy varying demands, e.g. thermal barrier- or hard coatings, thermal- or electrical conduction or insulation layers, or diffusion barriers. Howev
Externí odkaz:
https://doaj.org/article/e1bedfbde2ea4ad7a0f7d3d88df4f409
Publikováno v:
Applied Sciences, Vol 11, Iss 15, p 7009 (2021)
In many applications, voids in metals are observed as early degradation features caused by fatigue. In this publication, electropolishing is presented in the context of a novel sample preparation method that is capable of accessing voids in the inter
Externí odkaz:
https://doaj.org/article/6b45f7e5c3f349149e59a1976ca0ccd5
Autor:
Johannes Zechner
Publikováno v:
Museum & Society, Vol 15, Iss 2, Pp 267-268 (2017)
Wolfram Kaiser, Stefan Krankenhagen and Kerstin Poehls, Exhibiting Europe in Museums. Transnational Networks, Collections, Narratives and Representations, New York/Oxford: Berghahn Books, 2016 [hardback 2014], paperback £24.00, pp. viii+238.
Externí odkaz:
https://doaj.org/article/78d190b3f3b64d59a4ae813173f3662e
Autor:
Curran Kalha, Pardeep K. Thakur, Tien‐Lin Lee, Michael Reisinger, Johannes Zechner, Michael Nelhiebel, Anna Regoutz
Publikováno v:
Advanced Physics Research.
Autor:
Chaowei Du, James P. Best, Siyuan Zhang, Kurt Matoy, Michael Reisinger, Johannes Zechner, Werner Robl, Robert Hartl, Martin Kotzbauer, Christoph Kirchlechner, Gerhard Dehm
Publikováno v:
SSRN Electronic Journal.
Autor:
Sebastian Moser, Manuel Kleinbichler, Johannes Zechner, Michael Reisinger, Michael Nelhiebel, Megan J. Cordill
Publikováno v:
Microelectronics Reliability. 137:114782
Autor:
André Clausner, Ehrenfried Zschech, Johannes Zechner, Klaus Goller, Wieland Heyn, Sergey Ananiev, Hanno Melzner
Publikováno v:
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Autor:
Sebastian Moser, Daniel Tscharnuter, Michael Nelhiebel, Michael Reisinger, Johannes Zechner, Megan J. Cordill
Publikováno v:
Surface and Coatings Technology. 445:128715
Autor:
Megan J. Cordill, Reinhard Pippan, Manuel Kleinbichler, Gerald Zernatto, Johannes Zechner, Sebastian Moser, Michael Nelhiebel
Publikováno v:
JOM. 71:3399-3406
A novel experimental setup is presented to thermomechanically cycle metallizations in situ and, at the same time, study the progress of gradual changes in their microstructure using scanning electron microscopy. Very high heating rates are achieved b