Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Johannes Jaeschke"'
Autor:
Johannes Jaeschke, Martin Schneider-Ramelow, Marius van Dijk, Olaf Wittler, Andreas Stegmaier
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Warpage issues during the processing of System in Packages (SiPs), by means of Fan-Out Wafer Level Packaging (FO-WLP), is still a challenging task. The differences in thermal expansion coefficients of the dissimilar materials, as well as the cure-shr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9cf8c04f506085c7ee70312e4db79ca2
https://doi.org/10.1109/estc48849.2020.9229852
https://doi.org/10.1109/estc48849.2020.9229852
Autor:
Martin Schneider-Ramelow, Simon Schambeck, Johannes Jaeschke, Matthias Hutter, Andrea Deutinger
The combination of continuous miniaturization of electronics and the demanding reliability requirements for industrial and automotive electronics is one big challenge for emerging packaging technology. One aspect is to increase the understanding of t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::40e776c1f954a85dc9cd08a2fb0d4bd9
https://publica.fraunhofer.de/handle/publica/269801
https://publica.fraunhofer.de/handle/publica/269801
Publikováno v:
IFAC-PapersOnLine. 51:25-30
This paper considers the optimal operation of an oil and gas production network by formulating it as an economic nonlinear model predictive control (NMPC) problem. Solving the associated nonlinear program (NLP) can be computationally expensive and ti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ba53126b9b38adb28931b57b66fa8fc
https://doi.org/10.1016/j.ifacol.2018.06.350
https://doi.org/10.1016/j.ifacol.2018.06.350
Autor:
Thomas Cramer, Olaf Wittler, Saskia Huber, Florian Rost, Marius van Dijk, Johannes Jaeschke, Martin Schneider-Ramelow, Hans Walter
Publikováno v:
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The focus of this study concerns the thermo-mechanical understanding of prepreg materials during the lamination process in order to predict the correct warpage behavior of a multi-layer stack-up, and with that, the corresponding mechanical stress sta
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::85da4d24cf201c4d69f916d9a7dc801c
https://doi.org/10.1109/eurosime.2019.8724588
https://doi.org/10.1109/eurosime.2019.8724588
Autor:
Sven Thomas, Benjamin Fabian, Johannes Jaeschke, Martin Schneider-Ramelow, Olaf Wittler, Arian Grams
Publikováno v:
Microelectronics Reliability. 111:113683
A combined damage model has been built by the use of degradation models and finite element simulations as physics-of-failure method to determine degradation rates. This approach has some advantages over the more common Coffin-Manson approach like the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::659b7c829e2d9dd003c3624162f32eae
https://doi.org/10.1016/j.microrel.2020.113683
https://doi.org/10.1016/j.microrel.2020.113683
Publikováno v:
Optimization
Local sensitivity information is obtained for KKT points of parametric NLPs that may exhibit active set changes under parametric perturbations; under appropriate regularity conditions, computationally relevant generalized derivatives of primal and du
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b5e25bd4a0731cfa78c6ebb045961239
http://hdl.handle.net/11250/2564970
http://hdl.handle.net/11250/2564970
Publikováno v:
Zeitschrift für wirtschaftlichen Fabrikbetrieb. 103:544-548
Kurzfassung Zuverlässigkeit ist für moderne technische Produkte eine Grundvoraussetzung für den wirtschaftlichen Erfolg. Bedingt durch die hohe Komplexität der zumeist mechatronischen Systeme und die vielfältigen Abhängigkeiten muss heute ein e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1af2fd82a6e52adf8ba8738cc960576a
https://doi.org/10.3139/104.101322
https://doi.org/10.3139/104.101322
Publikováno v:
Journal of Solid State Lighting. 2
LED luminaires are already beyond retrofit systems, which are limited in heat dissipation due to the old fitting standards. Actual LED luminaries are based on new LED packages and modules. Heat dissipation through the first and second level interconn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::64c5cce2a0dbbc5335ed2670d9c0ff5e
https://doi.org/10.1186/s40539-015-0023-z
https://doi.org/10.1186/s40539-015-0023-z
Autor:
Johannes Jaeschke, Juergen Pfeil, Juergen Metzger, Oguz Celik, Ulf Waldenmaier, Fridolin Unfug, Uwe Wagner, Kai W. Beck
Publikováno v:
ASME 2012 Internal Combustion Engine Division Fall Technical Conference.
To fulfil strict emission regulations and the need for higher efficiency of future Diesel engines require an optimized combustion process. Optical investigations represent a powerful tool for getting a better understanding of the ongoing processes. F
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e30eac7c5072bf2a9bdf8eda39e5cbdb
https://doi.org/10.1115/icef2012-92038
https://doi.org/10.1115/icef2012-92038
Publikováno v:
3rd Electronics System Integration Technology Conference ESTC.
Further miniaturization of electronic systems is approaching new limits due to the failure mechanism of electromigration. Electromigration results in a transport of material in solder joints subjected to high electric current densities. This decrease
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ac1af770e5fab53bc65a03eb95816fa9
https://doi.org/10.1109/estc.2010.5642976
https://doi.org/10.1109/estc.2010.5642976