Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Johannes Hoerber"'
Publikováno v:
2015 38th International Spring Seminar on Electronics Technology (ISSE).
Optical waveguides enable the high speed transmission of data. In this context, Polymer Optical Fibers (POF) offer a great potential for creating an optical network on system level. This paper presents the results of an initial study on Aerosol Jet®
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0a661dd2da3ca174ffc428179e011ee0
https://doi.org/10.1109/isse.2015.7247951
https://doi.org/10.1109/isse.2015.7247951
Autor:
Dietmar Drummer, Joerg Franke, Johannes Hoerber, Christoph Heinle, Florian Ranft, Martin Mueller
Publikováno v:
Proceedings of the 2011 34th International Spring Seminar on Electronics Technology (ISSE).
The present study aims to display new opportunities for Molded Interconnect Devices by using thermally conductive thermoplastics as substrate materials. Therefore, a polyamide 66 polymer was modified with aluminum oxide and gains thermal conductivity
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::432c22055cf1fab1d2b7975ee2e2bda6
https://doi.org/10.1109/isse.2011.6053559
https://doi.org/10.1109/isse.2011.6053559
Autor:
Hoeber, Francis W.
Publikováno v:
Transactions of the American Philosophical Society; 2015, Vol. 105 Issue 1, p299-314, 16p
Autor:
Wimmer, Annette, Reichel, Herbert, Rauch, Bernhard, Schramm, Ren?, H?rber, Johannes, Habler, Bastian
Publikováno v:
2016 12th International Congress Molded Interconnect Devices (MID); 2016, p1-4, 4p
Publikováno v:
2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-34, 34p
Publikováno v:
2015 38th International Spring Seminar on Electronics Technology (ISSE); 2015, p5-10, 6p
Selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany
Autor:
Franke, Jörg
Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of ge
Autor:
Franke, Jörg
Räumliche elektronische Baugruppen (MID - Molded Interconnect Devices) ermöglichen die Integration mechanischer, elektronischer, optischer, thermischer und fluidischer Funktionen auf spritzgegossenen Komponenten. Mit der Funktionsintegration einher