Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Johan De Baets"'
Autor:
Herbert De Smet, Stefano Stanzione, Chris Van Hoof, Johan De Baets, Samira Zaliasl, Nick Van Helleputte, Bogdan Raducanu, Chris van Liempd, Andres Vasquez Quintero
Publikováno v:
IEEE SOLID-STATE CIRCUITS LETTERS
In a normally functioning eye, the iris controls the pupil diameter to regulate the amount of light reaching the retina. Various iris deficiencies exist, manifesting as defects in the iris or an absence of one which result in too much light reaching
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5c9506e0cd97020a7de31c141d0bff23
https://doi.org/10.1109/lssc.2020.3032232
https://doi.org/10.1109/lssc.2020.3032232
Autor:
Chris van Liempd, Nick Van Helleputte, Stefano Stanzione, Chris Van Hoof, Johan De Baets, Bogdan Raducanu, Samira Zali Asl, Andres Vasquez Quintero, Herbert De Smet
Publikováno v:
VLSI Circuits
2020 IEEE SYMPOSIUM ON VLSI CIRCUITS
2020 IEEE SYMPOSIUM ON VLSI CIRCUITS
In a functional eye, the iris controls the pupil diameter to regulate the exposure of the retina. While iris deficiencies such as aniridia or leiomyoma can be mitigated with fixed or adaptive artificial irises [1] and adaptive transparency glasses ex
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c4b7621c83232e3ed0b2e5886f441e42
https://doi.org/10.1109/vlsicircuits18222.2020.9163057
https://doi.org/10.1109/vlsicircuits18222.2020.9163057
Autor:
Bart Allaert, Riet Labie, Johan De Baets, Lieven Degrendele, Filip Vanhee, Franco Zanon, Bart Vandevelde, Ralph Lauwaert, Geert Willems, Davy Pissoort
Publikováno v:
Microelectronics Reliability. 74:131-135
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9caa99dda3b89f37183922e5af839a8b
https://doi.org/10.1016/j.microrel.2017.04.008
https://doi.org/10.1016/j.microrel.2017.04.008
Autor:
Hideki Ohmae, Frederick Bossuyt, Jeroen van den Brand, Jeroen Schram, Johan De Baets, Mitsuhiro Kasahara, Edsger C. P. Smits, Yoshihiro Tomita, Jan Vanfleteren
Publikováno v:
SID Symposium Digest of Technical Papers. 46:102-105
We present a stretchable and foldable passive matrix driven display using 45 by 80 RGB LED’s mounted on a meandering printed circuitry embedded in a polyurethane film. The meander interconnections have been optimized with respect to their electrica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8eedcd54e813a8c7d7186d458d5ebce
https://doi.org/10.1002/sdtp.10298
https://doi.org/10.1002/sdtp.10298
Autor:
Aritra Kundu, Andrea Firrincieli, Rik Verplancke, Rizwan Bashirullah, John O'Callaghan, Dries Braeken, Maarten Cauwe, Erin Patrick, Johan De Baets, Dieter Cuypers, Maaike Op de Beeck, Ahmed Fahmy, Marco Ballini, Bjorn Vandecasteele, David Schaubroeck, Alexandru Andrei, Nima Maghari
Publikováno v:
BioCAS
To realize optimal recording and stimulation of peripheral nerve cells, a CMOS chip is made with a multitude of electrodes which can be individually addressed in order to select after implantation the 16 best positioned electrodes. Since the Foreign
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c41a5bee1c16773f1ce6064ebce0ee7a
https://doi.org/10.1109/biocas.2017.8325206
https://doi.org/10.1109/biocas.2017.8325206
Autor:
Bart Vandevelde, Johan De Baets, Bart Allaert, Filip Vanhee, Geert Willems, Davy Pissoort, Ralph Lauwaert, Riet Labie, Lieven Degrendele
This paper deals with an alternative testing approach for quantifying the life time of board level solder joint reliability of components. This approach consists of applying a relative shear displacement between component and Printed Circuit Board (P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::62d8152507a0b79bc919fbcf066b25c9
https://lirias.kuleuven.be/handle/123456789/603652
https://lirias.kuleuven.be/handle/123456789/603652
Autor:
Tim Desmet, Sandra Van Vlierberghe, Johan De Baets, Etienne Schacht, David Schaubroeck, André Van Calster
Publikováno v:
Applied Surface Science. 255:8780-8787
The introduction of amine groups on the surface of dielectric resins improves the adhesion with electrochemically deposited metals. In this work, etched epoxy resin surfaces are modified with aliphatic amines via a two step wet chemical reaction appr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e373cb31fd86a648ddab59a58590cb05
https://doi.org/10.1016/j.apsusc.2009.06.043
https://doi.org/10.1016/j.apsusc.2009.06.043
Publikováno v:
Applied Surface Science. 252:2717-2740
Advanced printed circuit boards (PCBs) with sequential build-up (SBU) layers require alternating dielectric and copper layers on top of a core substrate. This can be achieved by lamination of resin coated copper (RCC) or by coating of dielectric poly
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::689a1dce176e0493441e2286e0e2c950
https://doi.org/10.1016/j.apsusc.2005.04.027
https://doi.org/10.1016/j.apsusc.2005.04.027
Publikováno v:
Microelectronics Reliability. 45:675-687
The plating quality results of high-aspect ratio through holes in industrially produced and sized printed circuit boards are reported in this paper. Test panels with 32,000 PTHs were processed on an existing industrial production line in order to tes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb9f527aa9f20f52148daf58ed0bd0c3
https://doi.org/10.1016/j.microrel.2004.07.009
https://doi.org/10.1016/j.microrel.2004.07.009
Publikováno v:
Applied Surface Science. :171-176
Microelectronics is moving towards smaller and lighter devices with high I/O counts. This involves the development of small via generation processes. Laser ablation technology is available and also compatible with conventional PCB technology. It allo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c7beda51013afeea768f1ac233513f75
https://doi.org/10.1016/s0169-4332(02)01362-4
https://doi.org/10.1016/s0169-4332(02)01362-4