Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Joe Pampanin"'
Autor:
Kadaba Lakshmikumar, Alexander Kurylak, Romesh Kumar Nandwana, Bibhu Das, Joe Pampanin, Mike Brubaker, Pavan Kumar Hanumolu
Publikováno v:
2023 IEEE International Solid- State Circuits Conference (ISSCC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9b59265fd753e8ff87fb79ef60be3c3
https://doi.org/10.1109/isscc42615.2023.10067483
https://doi.org/10.1109/isscc42615.2023.10067483
Autor:
Kadaba R. Lakshmikumar, Alexander Kurylak, Romesh Kumar Nandwana, Bibhu Das, Joe Pampanin, Vito Boccuzzi, Pavan Kumar Hanumolu
Publikováno v:
2022 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f8c5ce435f1f45893c1a50c54266d33
https://doi.org/10.1109/bcicts53451.2022.10051698
https://doi.org/10.1109/bcicts53451.2022.10051698
Autor:
Kadaba Lakshmikumar, Vito Boccuzzi, Manohar Nagaraju, Richard Booth, Alexander Kurylak, Joe Pampanin, Romesh Kumar Nandwana
Publikováno v:
IEEE Journal of Solid-State Circuits. 54:3180-3190
A linear transimpedance amplifier (TIA) for a 53 GBd PAM-4 optical link to support 100 Gb/s data on a single wavelength is reported. Designed in a 16 nm FinFET CMOS process, the chip consumes 60.8 mW with $\sqrt {\mathrm{Hz}}$ . Transimpedance can be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e80c70828fd53995749f41959831cd60
https://doi.org/10.1109/jssc.2019.2939652
https://doi.org/10.1109/jssc.2019.2939652
Publikováno v:
CICC
A linear TIA for a 53 GBd PAM-4 optical link to support 100 Gbps data rate on a single wavelength is reported. Designed in a 16 nm FinFET CMOS process, the chip consumes 61 mW with < 2 % THD at 600 mVpp differential output swing, 27 GHz bandwidth, an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf3abba0a37b96346372a4df12d6a49a
https://doi.org/10.1109/cicc.2018.8357007
https://doi.org/10.1109/cicc.2018.8357007