Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Joe Lachowski"'
Autor:
Hua Dong, Berry Paul, Janet Okada, Yil-Hak Lee, Matthew VanHanehem, Robert Auger, Paul Morganelli, Jonathan Prange, Ravi Pokhrel, Masaki Kondo, Ed Anzures, Michelle Ho, Joe Lachowski, Julia Kozhukh, Rosemary Bell, Michael K. Gallagher
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2019:001145-001164
As the electronics industry reaches the limits of lithographic processing at sub-10nm dimensions, alternate approaches to meet the demand for increasing device density, reducing package size and improving device performance are being explored. Die st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afa7dea64b3c6586cfed9e4693f05bb1
https://doi.org/10.4071/2380-4491-2019-dpc-presentation_tha1_076
https://doi.org/10.4071/2380-4491-2019-dpc-presentation_tha1_076
Autor:
Sue McNamara, Hua Dong, Jong-Uk Kim, Mike Gallagher, Aoude Tina, Bob Barr, Rosemary Bell, Joe Lachowski, Masaki Kondoh, Jeff Calvert, Joon-Seok Oh, Greg Prokopowicz, Louks David H
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2015:000679-000697
As the semiconductor industry drives to more functionality in smaller and lighter devices, it requires new materials to meet the changing requirements of new and more advanced chip designs and packaging solutions. Photoimagable polymeric dielectric m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d16efd1bbfe424b74b41a2f06d46cda9
https://doi.org/10.4071/2015dpc-tp26
https://doi.org/10.4071/2015dpc-tp26
Autor:
Anupam Choubey, Hua Dong, Joe Lachowski, Jong-Uk Kim, Kai Zoschke, Masaki Kondo, Corey O'connor, Michael Toepper, Rosemary Bell, Christina Lopper, Dow Electronic Materials, Matthias Wegner, Michael K. Gallagher, Bob Barr, Fraunhofer Izm, Greg Prokopowicz
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:000886-000912
The microelectronics industry is being continually challenged to decrease package size, lower power consumption and improve device performance for the mobile communication and server markets. In order to keep pace with these requirements, device manu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5da3fbf50eeff1ef568161ab9abc737
https://doi.org/10.4071/2014dpc-tp24
https://doi.org/10.4071/2014dpc-tp24
Autor:
Duane Romer, Sue McNamara, Greg Prokopowicz, Xiang Qian Liu, Mark S. Oliver, Seiji Inaoka, Matthew Yonkey, Rosemary Bell, Lynne K. Mills, Raymond Thibault, Joe Lachowski, Kevin Wang, Scott Kisting, Michael K. Gallagher, Kim Sang Ho, Eric Huenger
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:001559-001584
The advanced packaging application space continues to evolve as mobile devices pack more and more features into a limited space. This feature concentration is causing a deviation from the conventional shrinkage pathway predicted by Moore's law which,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ca910036b9c85a309d4086b9a24ff85
https://doi.org/10.4071/2013dpc-wp25
https://doi.org/10.4071/2013dpc-wp25
Autor:
Lynne K. Mills, Louks David H, Joe Lachowski, Matthew T. Bishop, Greg Prokopowicz, Eric Huenger, Christopher J. Tucker, Elissei Iagodkine, Zidong Wang, Zhifeng Bai, Michael K. Gallagher, Mark S. Oliver, Kevin Wang, Scott Kisting, Raymond Thibault
Publikováno v:
International Symposium on Microelectronics. 2013:000067-000071
3D IC integration based on TSV technology has been recognized as a key enabler for next generation of electronic devices with reduced size factor and improved performances. The adoption of 3D-TSV technology also requires the development of innovative
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c91d28c004069d606c44eb7671c6846
https://doi.org/10.4071/isom-2013-ta31
https://doi.org/10.4071/isom-2013-ta31
Autor:
Joe Lachowski, Michael K. Gallagher, Masaki Kondoh, Lynne K. Mills, Greg Prokopowicz, Eric Huenger, Ray Thibault, Scott Kisting
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2012:000986-001015
As advanced packaging application space evolves and continues to deviate from the conventional shrinkage pathway predicted by Moore's law, material suppliers need to continue to work with OEMs, OSATs and Foundries to identify specific opportunities.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::12cfe524b32a8e3a4ae3d7a19016ada1
https://doi.org/10.4071/2012dpc-tp25
https://doi.org/10.4071/2012dpc-tp25
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