Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Joe Abys"'
Autor:
Yun Zhang, Joe Abys, Ken Takahashi, Christopher Parks, Charles C. Goldsmith, Chen Wang, Charles L. Arvin, George J. Scott
Publikováno v:
ECS Transactions. 35:15-26
Semiconductor packaging technology requires understanding how the fundamental materials properties of different structures interact to impact the final reliability of the system, how to measure those properties and how to control them. We investigate
Publikováno v:
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
Creep corrosion failures have recently been seen on all surface finishes. The increase in occurrence of this phenomenon is a result of the convergence of alternative surface finishes, developed to support RoHS compliant, lead-free, fine-pitch technol
Autor:
Charles L. Arvin, George Scott, Charles Goldsmith, Christopher Parks, Chen Wang, Yun Zhang, Joe Abys, Ken Takahashi
Publikováno v:
ECS Meeting Abstracts. :1582-1582
not Available.