Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Jochen Dangelmaier"'
Autor:
Klaus Pressel, Jan Schischka, Jochen Dangelmaier, A. Graff, Horst Theuss, Matthias Petzold, S. Bennemann
Publikováno v:
2006 1st Electronic Systemintegration Technology Conference.
The paper focuses on electron microscopy investigations of board assembly for a new XFLGA package with emphasis on microstructure, intermetallic compound (IMC) and defect formation in solder to package and board metallization interfaces. XFLGA packag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2befe48db992d9775edef4831ea992dd
https://doi.org/10.1109/estc.2006.279974
https://doi.org/10.1109/estc.2006.279974
Evaluation of wirebond and flip-chip interconnects of a leadless plastic package for RF applications
Autor:
M. Engl, W. Eurskens, H. Knapp, Jochen Dangelmaier, K. Pressel, W. Simbuerger, R. Weigel, Horst Theuss
Publikováno v:
2005 7th Electronic Packaging Technology Conference.
We present a comparison of flip chip and wirebond first level interconnects used in a leadless plastic package with respect to high frequency performance. We apply numerical analysis and experimental measurements on high frequency devices. We show th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::20e96e2b4a14de15041ab1da50af8805
https://doi.org/10.1109/eptc.2005.1614411
https://doi.org/10.1109/eptc.2005.1614411
Autor:
Herbert Knapp, Werner Simburger, Horst Theuss, Klaus Pressel, Robert Weigel, B. Eisener, W. Eurskens, Mario Engl, Jochen Dangelmaier
Publikováno v:
2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535).
We present a static frequency divider operating up to 29 GHz in a tiny leadless plastic package. This innovative package, which is intended for high volume production at low cost, has an ultra-miniaturized footprint with a standard pad pitch of 0.5 m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36b31ed4eaea1f2343ae91319c4ab3d7
https://doi.org/10.1109/mwsym.2004.1336016
https://doi.org/10.1109/mwsym.2004.1336016
Publikováno v:
Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).
We report an innovative low cost leadless package concept with an ultra-miniaturized footprint and a significant height reduction. The package height has the potential to be made smaller than 0.4 mm. For discrete and low pin count solutions the packa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d0a9d60ed8a56a60a67b7151e92be038
https://doi.org/10.1109/eptc.2003.1271504
https://doi.org/10.1109/eptc.2003.1271504
Autor:
W. Eurskens, Horst Theuss, W. Simburger, J. Hirtreiter, H. Knapp, Robert Weigel, Jochen Dangelmaier, M. Engl, Klaus Pressel, K. Gnannt
Publikováno v:
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
We present a low cost leadless packaging concept for applications in the GHz region. This package concept has an ultra-miniaturized footprint, small dimensions of the contact pads, and a standard package height of 0.4 mm. Further reduction of the pac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f3dcb97c5934bc6148da19fc9e0141c8
https://doi.org/10.1109/ectc.2004.1320371
https://doi.org/10.1109/ectc.2004.1320371
Autor:
Matthias Petzold, Klaus Pressel, H. Kiendl, R. Lehner, Thomas Kilger, A. Graff, S. Paulus, Jan Schischka, Jochen Dangelmaier, Horst Theuss, B. Eisener
Publikováno v:
Scopus-Elsevier
We introduce an innovative flip chip in package concept based on small electroplated AuSn bumps as first level interconnect. Reliability studies prove the compliance of the leadless package concept to high quality standards, which include moisture se
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7658420c8d8b42f430d9fac126d64d11
http://www.scopus.com/inward/record.url?eid=2-s2.0-24644451679&partnerID=MN8TOARS
http://www.scopus.com/inward/record.url?eid=2-s2.0-24644451679&partnerID=MN8TOARS
