Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Joao Roberto Raposo De Oliveira Martins"'
Autor:
Joao Roberto Raposo De Oliveira Martins, Ali Mostafa, Jerome Juillard, Rachid Hamani, Francisco De Oliveira Alves, Pietro Maris Ferreira
Publikováno v:
IEEE Open Journal of Circuits and Systems, Vol 2, Pp 311-322 (2021)
The advent of the Internet-of-Things brings new challenges in circuit design. The presence of circuits and sensors in harsh environments brought the need for methodologies that account for them. Since the beginning of the transistors, the temperature
Externí odkaz:
https://doaj.org/article/137b553e8d2141d9961e3555d0437a0c
Autor:
Rachid Hamani, Joao Roberto Raposo De Oliveira Martins, Pietro Maris Ferreira, Francisco Alves, Ali Mostafa, Jerome Juillard
Publikováno v:
IEEE Open Journal of Circuits and Systems. 2:311-322
The advent of the Internet-of-Things brings new challenges in circuit design. The presence of circuits and sensors in harsh environments brought the need for methodologies that account for them. Since the beginning of the transistors, the temperature
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6c24b19066826133c1013622c3bddcf4
https://doi.org/10.1109/ojcas.2021.3067377
https://doi.org/10.1109/ojcas.2021.3067377
Autor:
Joao Roberto Raposo De Oliveira Martins, Ali Mostafa, Jerome Juillard, Rachid Hamani, Francisco De Oliveira Alves, Pietro Maris Ferreira
Publikováno v:
IEEE Open Journal of Circuits and Systems, Vol 2, Pp 311-322 (2021)
The advent of the Internet-of-Things brings new challenges in circuit design. The presence of circuits and sensors in harsh environments brought the need for methodologies that account for them. Since the beginning of the transistors, the temperature
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doajarticles::589722ded9acea1532226082311a8b15
https://ieeexplore.ieee.org/document/9382014/
https://ieeexplore.ieee.org/document/9382014/
Publikováno v:
Proc. IEEE Design, Test, Integration & Packaging of MEMS/MOEMS
Proc. IEEE Design, Test, Integration & Packaging of MEMS/MOEMS, May 2019, Paris, France
Proc. IEEE Design, Test, Integration & Packaging of MEMS/MOEMS, May 2019, Paris, France
Thermal drift is one of the main issues limiting the performance of resonant MEMS sensors. Their impact may be minimized at several levels, such as specific system-level solutions (e.g. differential sensing) or mechanical design (e.g. privileging sus
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cd5844f35b68f3ee443057459858ece8
https://doi.org/10.1109/dtip.2019.8752699
https://doi.org/10.1109/dtip.2019.8752699