Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Joachim Glueck"'
Publikováno v:
Microelectronics Reliability. 64:306-309
Thermal Laser Stimulation (TLS) for static logic state analysis is applied to failure analysis. Three case studies of analyses of the digital logic in an automotive Application Specific Integrated Circuit (ASIC) are discussed. By analyzing the logic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ae0ef0ddfb8cc72f6debf6086f1a551
https://doi.org/10.1016/j.microrel.2016.07.111
https://doi.org/10.1016/j.microrel.2016.07.111
Publikováno v:
Microelectronics Reliability. 64:656-659
We successfully applied high frequency scanning acoustic microscopy (SAM) as a tool for the analysis of MEMS sensors. Using state of the art transducers with frequencies up to 300 MHz, we evaluated the achievable resolution and performed case studies
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d1fa545775dea09672ee1fed36f8da70
https://doi.org/10.1016/j.microrel.2016.07.108
https://doi.org/10.1016/j.microrel.2016.07.108
Publikováno v:
Microelectronics Reliability. 54:1995-1999
High temperature storage lifetime tests of palladium coated copper bond wires (pcc-wires) beyond 1000 h@150 °C lead to an increased number of broken stitches during wire bond pull test. In this article we show that there is an intrinsic degradation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a058ad40f208d574efb16fc23478e9e
https://doi.org/10.1016/j.microrel.2014.07.097
https://doi.org/10.1016/j.microrel.2014.07.097
Autor:
Joachim Glueck
Publikováno v:
Journal of the Society for Information Display. 5:189
— A 14-in.-diagonal a-Si TFT AMLCD for PAL-TV is presented. The layout design is insensitive to fabrication tolerances, and the manufacturing process combines a low mask count of four steps with a large process window. Pixel charging with respect t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::04758ded6148819ca9016b37c4fee8ea
https://doi.org/10.1889/1.1985152
https://doi.org/10.1889/1.1985152
Publikováno v:
2006 IEEE International Test Conference; 2006, p1-2, 2p