Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Joachim Doering"'
Autor:
Christoph Brandstaetter, Ernst Haugeneder, Stefan Eder-Kapl, Hans-Joachim Doering, Helmut Langfischer, Martin Witt, Joerg Eichholz, Joachim Heinitz, Klaus Reimer
Publikováno v:
Microelectronic Engineering. 83:968-971
A proof-of-concept multi beam blanking device (''blanking demonstrator'') has been fabricated for the projection mask-less lithography project. It comprises a Si chip with approx. 4000 openings (each has a size of 8x8@mm^2) etched through with adjace
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4129629e2c1a9eb2018cee7b88f608ed
https://doi.org/10.1016/j.mee.2006.01.246
https://doi.org/10.1016/j.mee.2006.01.246
Autor:
Matthias Slodowski, Wolfgang Dorl, Joachim Heinitz, Matthias W. Klein, Thomas Elster, Hans-Joachim Doering, Ulf Weidenmüller, Ines A. Stolberg, Marc Schneider
Publikováno v:
Alternative Lithographic Technologies IV.
In the ITRS roadmap [1] increasingly long mask write and cycle time is explicitly addressed as a difficult challenge in mask fabrication for the 16nm technology node and beyond. Write time reduction demands have to be seen in relation to correspondin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6e0f9462c85c0795dff44d54fa418568
https://doi.org/10.1117/12.916394
https://doi.org/10.1117/12.916394
Publikováno v:
Alternative Lithographic Technologies III.
According to the ITRS [1] photo mask is a significant challenge for the 22nm technology node requirements and beyond. Mask making capability and cost escalation continue to be critical for future lithography progress. On the technological side mask s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::872e045eae77f54f3ef8bca504696abd
https://doi.org/10.1117/12.879446
https://doi.org/10.1117/12.879446
Autor:
Arnd Stoeckel, Monika Boettcher, Renate Jaritz, Hans-Joachim Doering, Juergen Gramss, Ulf Weidenmueller
Publikováno v:
27th European Mask and Lithography Conference.
Multi Shaped Beam (MSB) throughput simulation results have already been published in the past. An IC mask set of a 32nm node logic device was one of the applications that had been analyzed in more detail. In this paper we want to highlight results of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36bb597a9328d449a69883b0c7421114
https://doi.org/10.1117/12.896883
https://doi.org/10.1117/12.896883
Autor:
Hans Ulrich Hund, Joachim Doering, Heinz Berke, H. William Bosch, Wolfgang Bidell, Elisabeth Plappert
Publikováno v:
Inorganic Chemistry. 32:502-507
On reaction of [Y(OCH[sub 2]CH[sub 2]OMe)[sub 3]][sub 10] (2) with [(thd)Cu(OCH[sub 2]CH[sub 2]OMe)][sub 4] (1a) and [(hfd)Cu(OCH[sub 2]CH[sub 2]OMe)][sub 4] (1b) (thd = 2,2,6,6-tetramethyl-3,5-heptanedione; hfd = 1,1,1,5,5,5-hexafluoroacetylacetone)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ac88fcceebb9444f01341651caf7f0f
https://doi.org/10.1021/ic00057a004
https://doi.org/10.1021/ic00057a004
Autor:
Martin Sczyrba, Juergen Gramss, Ulf Weidenmueller, Michael Finken, Arnd Stoeckel, Hans-Joachim Doering, Martin Bloecker, Timo Wandel, Detlef Melzer
Publikováno v:
SPIE Proceedings.
Photomask lithography for the 22nm technology node and beyond requires new approaches in equipment as well as mask design. Multi Shaped Beam technology (MSB) for photomask patterning using a matrix of small beamlets instead of just one shaped beam, i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50fc3368785028aeda386846047ffd47
https://doi.org/10.1117/12.865708
https://doi.org/10.1117/12.865708
Magnetic properties of high-nuclearity spin clusters. Fourteen- and fifteen-oxovanadium(IV) clusters
Publikováno v:
Scopus-Elsevier
The magnetic properties of K 6 [V 15 As 6 O 42 (H 2 O)].8H 2 O (V 15 ) and (NH 4 ) 6 [V 14 As 8 O 42 (SO 3 )] (V 14 ) which comprise fifteen- and fourteen-vanadium(IV) ions, respectively, have been investigated. The analysis of the magnetic susceptib
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b26cfedff6a5f3ad5bd35ce88c8a4f32
https://doi.org/10.1021/ja00048a023
https://doi.org/10.1021/ja00048a023
Publikováno v:
Alternative Lithographic Technologies.
This paper describes a new multi beam approach in electron beam lithography called Multi Shaped Beam (MSB). Based on the well known Variable Shaped Beam (VSB) principle, the single shaped beam arrangement is extended and complemented by an array of i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8e00f320de1e89018a5c032981d2c2bf
https://doi.org/10.1117/12.814113
https://doi.org/10.1117/12.814113
Autor:
Johannes Kretz, Juergen Gramss, Laurent Pain, Hans-Joachim Doering, Peter Hahmann, Monika Boettcher, Ines A. Stolberg
Publikováno v:
23rd European Mask and Lithography Conference.
In semiconductor industry time to market is one of the key success factors. Therefore fast prototyping and low-volume production will become extremely important for developing process technologies that are well ahead of the current technological leve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4084852299e1abff7f0ccf5dbb95fe7
https://doi.org/10.1117/12.736974
https://doi.org/10.1117/12.736974
Autor:
Maati Talmi, Peter Jochl, Thomas Elster, Ramona Eberhardt, Ernst Haugeneder, Stefan Eder-Kapl, Hans-Joachim Doering, Olaf Fortagne, Juergen Saniter, Klaus Reimer, Joachim Heinitz, Gertraud Lammer, Klaus Kroenert, Christoph Brandstaetter, Hans Loeschner
Publikováno v:
SPIE Proceedings.
Electron beam based Projection Mask-Less Lithography (PML2) is one of the promising candidates for fast chip devel-opment and prototyping as well as for small and medium volume device production for the 45nm technology node and beyond. The concept of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3094c16759b3cd96acf51e28bd4f7339
https://doi.org/10.1117/12.637298
https://doi.org/10.1117/12.637298