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Autor:
Hsiao Chin Tuan, Chun-Wen Cheng, Chia-Hua Chu, Weileun Fang, Jiou-Kang Lee, Kai-Chih Liang, Alex Kalnitsky, David A. Horsley, Chung-Hsien Lin, Te-Hao Lee
Publikováno v:
2012 IEEE Sensors.
A MEMS process scheme designed for multi- sensors is presented. This new process scheme includes a poly bump not only provides stiction prevention and gap control function, and also electrical connection between MEMS structure and routing lines. Anot