Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Jinuk, Lee"'
Autor:
Jeong-Hyeon Na, Jun-Hyeong Park, Won Park, Junhao Feng, Jun-Su Eun, Jinuk Lee, Sin-Hyung Lee, Jaewon Jang, In Man Kang, Do-Kyung Kim, Jin-Hyuk Bae
Publikováno v:
Nanomaterials, Vol 14, Iss 5, p 466 (2024)
The initial electrical characteristics and bias stabilities of thin-film transistors (TFTs) are vital factors regarding the practical use of electronic devices. In this study, the dependence of positive bias stress (PBS) instability on an initial thr
Externí odkaz:
https://doaj.org/article/5e84f4fc6fef43b4afe2a5659348c1e3
Autor:
Jun-Hyeong Park, Won Park, Jeong-Hyeon Na, Jinuk Lee, Jun-Su Eun, Junhao Feng, Do-Kyung Kim, Jin-Hyuk Bae
Publikováno v:
Nanomaterials, Vol 13, Iss 18, p 2568 (2023)
High-performance oxide transistors have recently attracted significant attention for use in various electronic applications, such as displays, sensors, and back-end-of-line transistors. In this study, we demonstrate atomically thin indium–oxide (In
Externí odkaz:
https://doaj.org/article/d5ee157698dc452a893da41d485ddb14
Autor:
Won Park, Jun-Hyeong Park, Jun-Su Eun, Jinuk Lee, Jeong-Hyeon Na, Sin-Hyung Lee, Jaewon Jang, In Man Kang, Do-Kyung Kim, Jin-Hyuk Bae
Publikováno v:
Nanomaterials, Vol 13, Iss 15, p 2231 (2023)
The interest in low processing temperature for printable transistors is rapidly increasing with the introduction of a new form factor in electronics and the growing importance of high throughput. This paper reports the fabrication of low-temperature-
Externí odkaz:
https://doaj.org/article/0367b8e7a0cb442a8fae25fb7b868b07
Publikováno v:
Energies, Vol 15, Iss 9, p 3331 (2022)
In this paper, a new integrated system of solid oxide fuel cell (SOFC)–gas turbine (GT)–steam Rankine cycle (SRC)–exhaust gas boiler (EGB) is presented, in which ammonia is introduced as a promising fuel source to meet shipping decarbonization
Externí odkaz:
https://doaj.org/article/c4bae54475e04edfa85cbe7bb19e4816
Publikováno v:
Journal of Clinical Medicine; Volume 12; Issue 13; Pages: 4548
Maintaining physical activity is important for children with cerebral palsy (CP). This study examined whether age predicted habitual physical activity (HPA) or cardiorespiratory fitness (CRF) in school-aged children with CP and clarified the relation
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=multidiscipl::afe26b774f97617e5dacbce6e6b24efd
Autor:
Boris V, Merinov, Saber, Naserifar, Sergey V, Zybin, Sergey, Morozov, William A, Goddard, Jinuk, Lee, Jae Hyun, Lee, Hyea Eun, Han, Young Cheol, Choi, Seung Ha, Kim
Publikováno v:
The Journal of chemical physics. 152(3)
We previously reported comprehensive density functional theory-molecular dynamics (DFT-MD) at 400 K to determine the composition and structure of the solid electrolyte interface (SEI) between a Li anode and [Pyr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::104b94b1b419b4305be91c822b54e589
https://pubmed.ncbi.nlm.nih.gov/31968966
https://pubmed.ncbi.nlm.nih.gov/31968966
Autor:
Boris V, Merinov, Sergey V, Zybin, Saber, Naserifar, Sergey, Morozov, Julius, Oppenheim, William A, Goddard, Jinuk, Lee, Jae Hyun, Lee, Hyea Eun, Han, Young Cheol, Choi, Seung Ha, Kim
Publikováno v:
The journal of physical chemistry letters. 10(16)
Ionic liquids (ILs) are promising materials for application in a new generation of Li batteries. They can be used as electrolyte or interlayer or incorporated into other materials. ILs have the ability to form a stable solid electrochemical interface
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::4ccf9eb27b9a6c1457ac6919a702d354
https://pubmed.ncbi.nlm.nih.gov/31344329
https://pubmed.ncbi.nlm.nih.gov/31344329
Publikováno v:
2018 Pan Pacific Microelectronics Symposium (Pan Pacific).
In the PCB industry, Cu is the most commonly used metal for circuit line and pad materials. In this study the etching behavior of Cu in two different cases. First, the etching behavior of Cu when connected with Au was studied. After the wiring proces
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::be3216a1500da83ba15e911276ea18ac
https://doi.org/10.23919/panpacific.2018.8319019
https://doi.org/10.23919/panpacific.2018.8319019
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
Electroless Cu plating has been used in PCB industry when circuit was made upon non-conductive substrate. Adhesion is getting important since the size of L/P is reduced. The adhesion of copper on substrate is mainly dependent on Pd activation and cop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b262de605085448576ef7dbbd960fdcd
https://doi.org/10.23919/icep.2017.7939318
https://doi.org/10.23919/icep.2017.7939318
Publikováno v:
Journal of Chemical Physics; 8/7/2006, Vol. 125 Issue 5, p054911, 8p, 5 Graphs