Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Jingrui, Chai"'
Autor:
Linghui Kong, Xuelian Shu, Siyuan Tang, Rongrong Ye, Huijiao Sun, Shuang Jiang, Zixiang Li, Jingrui Chai, Yun Fang, Yinjie Lan, Linqian Yu, Qiong Xie, Wei Fu, Yujun Wang, Wei Li, Zhuibai Qiu, Jinggen Liu, Liming Shao
Publikováno v:
Journal of Medicinal Chemistry. 65:10377-10392
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ed02dcb7bf2730e4c501b9c79c8314d
https://doi.org/10.1021/acs.jmedchem.2c00014
https://doi.org/10.1021/acs.jmedchem.2c00014
Autor:
Song Wang, Xiping Jiang, Fengguo Zuo, Huimei Wang, Xiaofeng Zhou, Jingrui Chai, Yubing Wang, Bin Hou, Liang Zhong, Wenxin Li, Yi Kang
Publikováno v:
2022 China Semiconductor Technology International Conference (CSTIC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::68bac2d61a36fabd6d19ddd83ed820da
https://doi.org/10.1109/cstic55103.2022.9856859
https://doi.org/10.1109/cstic55103.2022.9856859
Autor:
Qian, He, Yuanyuan, Wei, Xiao, Liu, Rongrong, Ye, Linghui, Kong, Zixiang, Li, Shuang, Jiang, Linqian, Yu, Jingrui, Chai, Qiong, Xie, Wei, Fu, Yujun, Wang, Wei, Li, Zhuibai, Qiu, Jinggen, Liu, Liming, Shao
Publikováno v:
Journal of medicinal chemistry. 64(16)
The search for selective kappa opioid receptor (κOR) agonists with an improved safety profile is an area of interest in opioid research. In this work, a series of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::55001ea8ace72d5398674b3c06177712
https://pubmed.ncbi.nlm.nih.gov/34387468
https://pubmed.ncbi.nlm.nih.gov/34387468
Autor:
Song Wang, Peng Yin, Xiping Jiang, Zhengwen Wang, Gang Dong, Mei Li, Qiwei Ren, Jie Tan, Xiaofeng Zhou, Bing Yu, Xudong Gao, Jingrui Chai
Publikováno v:
2021 IEEE International Interconnect Technology Conference (IITC).
Wafer-to-wafer hybrid bonding technology is used to realize a DRAM array wafer and a logic wafer face-to-face connected with the advantages of a high density integration for high bandwidth and energy efficiency. With the proposed stacked embedded DRA
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d777327a1d098930058e3fb0f3ef17d2
https://doi.org/10.1109/iitc51362.2021.9537362
https://doi.org/10.1109/iitc51362.2021.9537362
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 9:877-887
To investigate the thermal behavior of 3-D integrated circuits, long computational times are required for large-scale stacked chips with a complicated structure. In this paper, an equivalent anisotropic thermal model is introduced to reduce the compu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3db939429dff40b2f7691ea68c8fe7bc
https://doi.org/10.1109/tcpmt.2019.2893323
https://doi.org/10.1109/tcpmt.2019.2893323
Publikováno v:
IEEE Transactions on Electron Devices. 66:1032-1040
In this paper, a through-silicon via (TSV) array under Gaussian pulse is studied comprehensively with a rigorous consideration of its electrothermal characteristics. To enhance the computational efficiency and reduce the memory cost, we develop a uni
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61caca699d48b79587b2b469e0e7d8bb
https://doi.org/10.1109/ted.2018.2888870
https://doi.org/10.1109/ted.2018.2888870
Autor:
Huoming, Huang, Xueping, Li, Peng, Xie, Xinwei, Li, XueJun, Xu, Yuanyuan, Qian, Congmin, Yuan, Xiangguo, Meng, JingRui, Chai, Jing, Chen, Jing, Liu, Wenli, Wang, Wei, Li, YuJun, Wang, Wei, Fu, Jinggen, Liu
Publikováno v:
Journal of medicinal chemistry. 64(13)
Management of moderate to severe pain relies heavily on opioid analgesics such as morphine, oxycodone, and fentanyl in clinics. However, their prolonged use was associated with undesirable side effects. Many new strategies to reduce side effects have
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::fac36c5d300a6e7b662190d6d8438e94
https://pubmed.ncbi.nlm.nih.gov/34152138
https://pubmed.ncbi.nlm.nih.gov/34152138
Publikováno v:
2020 21st International Conference on Electronic Packaging Technology (ICEPT).
nowadays, Double Data Rate (DDR) modules are generally applied in the electronic products. In this paper, the key failure modes for solder joints of DDR module are introduced. For many kinds of finishes, the typical intermetallic compounds (IMCs) fou
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ec6f322ebecf8e2956f92c21ff5638c9
https://doi.org/10.1109/icept50128.2020.9202884
https://doi.org/10.1109/icept50128.2020.9202884
Publikováno v:
Microelectronics Journal. 63:20-26
In this paper, a universal closed-form expression for the parasitic inductance of tapered through-silicon vias (T-TSVs) with a frequency of up to 20GHz is proposed. The expression, which considers skin and proximity effects, can be used to calculate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb2af982b5d3666dc697e1459354d95d
https://doi.org/10.1016/j.mejo.2017.02.015
https://doi.org/10.1016/j.mejo.2017.02.015
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
In this paper, in order to further reduce the electromagnetic crosstalk of the TSV array, we proposed a layout of TSV array which the differential signal TSVs are interleaved with the ground TSVs due to the excellent noise suppression of the shielded
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::577a7577a53273d1cdbd2b73bd80db81
https://doi.org/10.1109/icept.2018.8480511
https://doi.org/10.1109/icept.2018.8480511