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pro vyhledávání: '"Jingli Ke"'
Autor:
Min Shang, Chenyu Li, Yanchen Wang, Xiangxu Chen, Yuanbang Zhao, Jingli Ke, Yunpeng Wang, Haitao Ma, Jun Chen
Publikováno v:
Journal of Materials Research and Technology, Vol 33, Iss , Pp 6307-6318 (2024)
In the use of Sn58Bi solder alloy, the abnormal enrichment and coarsening of Bi phase in solder joints and the excessive growth of IMC seriously affect its service reliability, among which, the IMC's reaction mechanism and evolution, the influence on
Externí odkaz:
https://doaj.org/article/8b211f3efe1c474488ea61173a029544
