Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Jingguang Yao"'
Publikováno v:
Micromachines, Vol 14, Iss 11, p 2129 (2023)
The replacement of gold bonding wire with silver bonding wire can significantly reduce the cost of wire bonding. This paper provides a comprehensive overview of silver wire bonding technology. Firstly, it introduces various types of silver-based bond
Externí odkaz:
https://doaj.org/article/45d5980bbf9f4f578579c40c892a34b4
Autor:
Hongliang Zhou, Andong Chang, Junling Fan, Jun Cao, Bin An, Jie Xia, Jingguang Yao, Xiaobin Cui, Yingchong Zhang
Publikováno v:
Micromachines, Vol 14, Iss 8, p 1612 (2023)
This paper provides a comprehensive review on copper (Cu) wire bonding. Firstly, it introduces the common types of Cu wire available in the market, including bare Cu wire, coated Cu wire, insulated Cu wire, and alloyed Cu wire. For each type, their c
Externí odkaz:
https://doaj.org/article/f1e56f62464f4183896ff5fa3f7dae48