Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Jing Bo Zeng"'
Autor:
Min Lin, Ying-Fang Wen, Jiao-Ren Wu, Qian Wang, Lei Zheng, Gui-Rong Liu, Yue Huang, Hui Yang, Fen Lin, Xiao-Fen Zhan, Chun-Ping Lin, Hui-Tian Yang, Qiu-Qing Weng, Fen-Ting Huang, Yuan Wang, Mei-Qiong Yao, Hui-Zhou Chen, Di-Hong Wu, Jing-Bo Zeng, Ri-Xin Zeng, Hua Yang, Gui-Cai Li, Min Lu, Juan-Juan Zhu, Long-Xu Xie, Jun-Li Wang, Li-Ye Yang
Publikováno v:
PLoS ONE, Vol 8, Iss 2, p e55024 (2013)
BACKGROUND: Hemoglobinopathies are the most common inherited diseases in southern China. However, there have been only a few epidemiological studies of hemoglobinopathies in Guangdong province. MATERIALS AND METHODS: Peripheral blood samples were col
Externí odkaz:
https://doaj.org/article/596ec508e300495bb7424009bd31acb0
Publikováno v:
Materials Science and Engineering: A. 617:14-23
Solder joints are generally regarded as the weakest part in packaging systems and electronic assemblies in modern electronic products and devices. In this study, both experimental and finite element methods were used to characterize the mechanical be
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3a2ee8c7869cfbfd338557593cc1b4fe
https://doi.org/10.1016/j.msea.2014.08.008
https://doi.org/10.1016/j.msea.2014.08.008
Publikováno v:
Chinese Medical Sciences Journal. 29:167-173
To investigate the expression of phosphatase and tension homolog (PTEN) in adipose tissue of KKAy diabetic mice, a mouse model of type 2 diabetes.KKAy diabetic mice were fed with high fat diet for 4 weeks. After blood glucose met the criteria of diab
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7ea7af6329a38c5580f2babebd57fd3a
https://doi.org/10.1016/s1001-9294(14)60063-8
https://doi.org/10.1016/s1001-9294(14)60063-8
Publikováno v:
2013 14th International Conference on Electronic Packaging Technology.
Isothermal aging effect on the microstructure and mechanical properties of line-type Ni/Sn3.0Ag0.5Cu/Ni sandwich structure interconnects with small heights of 50 and 25 μm was investigated in this study. Microstructural analysis showed that interfac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9aa3f2947712aa47bd05749e595cd26b
https://doi.org/10.1109/icept.2013.6756628
https://doi.org/10.1109/icept.2013.6756628
Publikováno v:
2013 14th International Conference on Electronic Packaging Technology.
The influence of the cooling rate and the type of under bump metallization (UBM, i.e., Cu and Ni) on the undercooling and solidification behavior of Sn-Ag-Cu (SAC) based solders (i.e., Sn-1.0Ag-0.5Cu, Sn-3.0Ag-0.5Cu and Sn-3.8Ag-0.7Cu) and their join
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5a0cd2689d41505c6a45dc49063d61ae
https://doi.org/10.1109/icept.2013.6756481
https://doi.org/10.1109/icept.2013.6756481
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
The effect of solder volume on the interfacial microstructure and mechanical properties of micro-scale line-type Ni/Sn3.0Ag0.5Cu/Ni joints was investigated. Ni wires of 300 µm in diameter were used as under-bump-metallization (UBM) to be connected b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d0ed44d49b166793da63a69d5685ea9
https://doi.org/10.1109/emap.2012.6507872
https://doi.org/10.1109/emap.2012.6507872
Publikováno v:
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
The dissolution of the under bump metallization (UBM) into the molten solder is inevitable during the soldering process. However, overly dissolved UBM can lead to the excessive growth of interfacial intermetallic compound (IMC) and change the solder'
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46c1aa23eebfb53d146280d30838b214
https://doi.org/10.1109/icept-hdp.2012.6474749
https://doi.org/10.1109/icept-hdp.2012.6474749
Publikováno v:
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
The morphological evolution of Cu6Sn5 grains formed at the interfaces of “Sn-3.0Ag-0.5Cu/Poly-crystal Cu (PC-Cu)” and “Sn-3.0Ag-0.5Cu/Single crystal Cu (SC-Cu)” under different reflow conditions was investigated. Reflow experiments were perfo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::10c541aa41275b399928462a9c5bc83a
https://doi.org/10.1109/icept-hdp.2012.6474620
https://doi.org/10.1109/icept-hdp.2012.6474620
Autor:
Jing Bo Zeng, Qun Di Lin, Guo Long Yu, Bing Yi Zhou, Wei Ying Jiang, Hua Liang, Han Liu, Hong Li Xi
Publikováno v:
Biochemical genetics. 50(1-2)
Knowledge of the G6PD genotype and its associated enzyme activity is significant for population genetics, diagnosis of disease, and management of patients. We tested 2,872 unrelated subjects from a Hakka population in China for G6PD activity by the W
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d5b20bcf9236fa3fb0e37dac109cb466
https://pubmed.ncbi.nlm.nih.gov/21874587
https://pubmed.ncbi.nlm.nih.gov/21874587
Autor:
Yuxiu Li, Jian-chun Yu, Qian Zhang, Wei Qin, Kang Yu, Jing-bo Zeng, Qiu-ying Liu, Heng Wang, Qi Sun
Publikováno v:
Chinese medical journal. 121(8)
BACKGROUND This prospective, randomized, controlled study was designed to investigate the effects of a diabetes specific formula (Diason low energy: 313.8 kJ/100 ml), compared with a standard formula, on insulin sensitivity, serum C peptide, serum li
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::1c346c85c36a2b6872e0dc660b77e18e
https://pubmed.ncbi.nlm.nih.gov/18701020
https://pubmed.ncbi.nlm.nih.gov/18701020