Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Jinfeng Qin"'
Publikováno v:
Industrial & Engineering Chemistry Research. 62:3176-3182
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13e2e6a39b903733f60d5a6b78f20693
https://doi.org/10.1021/acs.iecr.2c04247
https://doi.org/10.1021/acs.iecr.2c04247
Autor:
Manman Wang, Qinghai Shu, Yansong Shi, Chien-Lung Teng, Junfeng Wang, Shaohua Jin, Shusen Chen, Jinfeng Qin, Dongxu Wang
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::755e58b2161cca371f15fc0e193c40ae
https://doi.org/10.2139/ssrn.4011021
https://doi.org/10.2139/ssrn.4011021
Autor:
Manman Wang, Qinghai Shu, Yansong Shi, Chien-Lung Teng, Junfeng Wang, Shaohua Jin, Shusen Chen, Jinfeng Qin, Dongxu Wang
Publikováno v:
Journal of Alloys and Compounds. 915:165394
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f16fdac2aabdc3bf247e8b2be5bd2ff
https://doi.org/10.1016/j.jallcom.2022.165394
https://doi.org/10.1016/j.jallcom.2022.165394
Publikováno v:
Electrochimica Acta. 401:139445
Leveler is one of the most important additives for super-conformal copper electroplating, which has been widely applied in the fabrication of nanoscale (or microscale) interconnect features in integrated circuits (ICs) and printed circuit boards (PCB
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0161b91540656797680fc93851d0df24
https://doi.org/10.1016/j.electacta.2021.139445
https://doi.org/10.1016/j.electacta.2021.139445
Autor:
Lei Wang, Jiye Luo, Danqing Liu, Shihui Qin, Jiaoying Jin, Jingjuan Tan, Si Huang, Jinfeng Qin
Publikováno v:
Advanced Electronic Materials. 7:2100557
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1214b96ae3f636c13e4760f54c94ab38
https://doi.org/10.1002/aelm.202100557
https://doi.org/10.1002/aelm.202100557
Publikováno v:
Forensic science international. Genetics. 40
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::97efdd69562d8405796bdd3227545294
https://pubmed.ncbi.nlm.nih.gov/30904412
https://pubmed.ncbi.nlm.nih.gov/30904412
Publikováno v:
DEStech Transactions on Computer Science and Engineering.
The design is based on CRS8635 chip development, the use of the wireless Bluetooth headset module. Bluetooth headset module 2.4GHZ band in the free use of state, wireless connection and exchange data between multiple devices to communicate with devic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::00f5c486d074b2ecf89dd1e06177e702
https://doi.org/10.12783/dtcse/cii2017/17284
https://doi.org/10.12783/dtcse/cii2017/17284
Publikováno v:
Proceedings of the 2nd International Conference on Computer Engineering, Information Science & Application Technology (ICCIA 2017).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63b32fd3e4584a04e7357259f04c7b13
https://doi.org/10.2991/iccia-17.2017.77
https://doi.org/10.2991/iccia-17.2017.77