Zobrazeno 1 - 3
of 3
pro vyhledávání: '"JinKun Yoo"'
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e23ee3705ef4c8d987b444ed192c29e
https://doi.org/10.1109/ectc51906.2022.00238
https://doi.org/10.1109/ectc51906.2022.00238
Autor:
KiYeul Yang, JunHwan Park, WonChul Do, SangHyoun Lee, JinKun Yoo, SeokHun Yun, JinYoung Khim, MinJae Yi, JiHun Yi, EunTaek Jeong, SeungNam Son, DongHyun Khim
Publikováno v:
2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
Fan-Out Wafer-Level Interposer Package-on-Package (PoP) design has many advantages for mobile applications such as low power consumption, short signal path, small form factor and heterogeneous integration for multi-functions. In addition, it can be a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01d59997863dce00dbc4dfd32048e8b2
https://doi.org/10.1109/ectc32862.2020.00298
https://doi.org/10.1109/ectc32862.2020.00298
Autor:
WangGu Lee, Rick Reed, Rahul Agarwal, JinKun Yoo, Luke England, Sukeshwar Kannan, SangHyoun Lee, Yong Song
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
In this paper, the processing and integration challenges addressed during the 3D packaging of a ~400 mm2 logic die are presented and discussed. The logic die was fabricated using GLOBALFOUNDRIES' 14-nm technology with 5x55 µm Through Silicon Vias (T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed0772885e4af78840713a7b151b691b
https://doi.org/10.1109/ectc.2017.169
https://doi.org/10.1109/ectc.2017.169