Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Jin-Ye Jaung"'
Autor:
Jin-Ye Jaung, Chien-Wei Chien, Hsien-Chie Cheng, Yuan-Chang Lee, Li-Cheng Shen, Wei-Chung Lo, Chia-Te Lin, Chao-Kai Hsu, Yin-Po Hung
Publikováno v:
2008 58th Electronic Components and Technology Conference.
To prevent potential yield loss, achieve TSV with higher aspect ratio, improve the bonding reliability, and reduce the process cost, a clamped through silicon via (C-TSV) interconnection for stacked chip bonding is proposed and developed in this pape
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::20a83defdf3fa95a79fbdb17f89efef3
https://doi.org/10.1109/ectc.2008.4550026
https://doi.org/10.1109/ectc.2008.4550026
Autor:
Li-Cheng Shen, Chien-Wei Chien, Jin-Ye Jaung, Yin-Po Hung, Wei-Chung Lo, Chao-Kai Hsu, Yuan-Chang Lee, Hsien-Chie Cheng, Chia-Te Lin
Publikováno v:
2008 58th Electronic Components & Technology Conference; 2008, p544-549, 6p