Zobrazeno 1 - 10
of 106
pro vyhledávání: '"Jin-Wook Jang"'
Publikováno v:
Agriculture, Vol 13, Iss 8, p 1520 (2023)
We propose an optimal system for determining the shipping schedule for pigs using a predictive model using machine learning based on big data. This system receives photographic and weight measurement information for each pig from a camera and a weigh
Externí odkaz:
https://doaj.org/article/e7a09fd345f5455182971901cc1b9e7a
Autor:
Jin-Wook Jang
Publikováno v:
The Journal of Korean Institute of Information Technology. 21:107-115
Publikováno v:
2023 IEEE International Conference on Big Data and Smart Computing (BigComp).
Autor:
Jin-wook Jang
Publikováno v:
Turkish Journal of Computer and Mathematics Education (TURCOMAT). 12:216-222
This research study designed a location image collecting technology. It provides the exact location information of an image which is not given in the photo to the user. Deep learning technology analysis and collects the images. The purpose of this se
Autor:
Hee Young Kim, Jin Wook Jang, Hye-Jin Kim, Woo Hyun Cho, Mihyang Ha, Bong Soo Son, Hye Ju Yeo
Publikováno v:
Journal of Clinical Medicine; Volume 11; Issue 8; Pages: 2199
Background: To date, there have been no reports assessing the incidence, risk factors, and clinical outcomes of GB disease in patients receiving ECMO for cardiorespiratory failure. Methods: The medical records of adults (aged > 18 years) who underwen
Publikováno v:
Journal of Electronic Materials. 47:7531-7536
The corrosion morphology of a sputtered Al thin film covered with a polymer epoxy is investigated. After storage under a typical humidity condition of 85%/85°C (humidity/temperature) in the presence of Cl− ions, a uniform Al(OH)3 layer formed on t
Publikováno v:
Journal of Materials Science: Materials in Electronics. 28:17038-17043
We report a new failure phenomenon in the ball grid array (BGA) package mounted on a board. The composition of BGA solder was Sn-1.0 wt%Ag-0.5 wt%Cu (SAC105) alloy. In-situ bending of the mounted board at 223 °C led to a BGA joint crack between Cu6S
Film Properties of Al Thin Films Depending on Process Parameters and Film Thickness Grown by Sputter
Publikováno v:
Korean Journal of Materials Research. 26:438-443
We developed an Al sputtering process by varying the plasma power, process temperature, and film thickness. We observed an increase of hillock distribution and average diameter with increasing plasma power, process temperature, and film thickness. Si
Publikováno v:
Food Science and Biotechnology. 24:1927-1931
A survey for trimethoprim (TMP) was performed using 369 livestock and marine products distributed in Korea. Product samples included beef, pork, milk, egg, chicken, flatfish, jacopever, common eel, and shrimp. TMP residues were analyzed using ultra p
Autor:
Dong Hoon Kam, Jong-Il Yun, Jin-Wook Jang, Sol-Chan Han, Tae-Hyeong Kim, Shin-Hyun Kang, Yong Hoon Jeong, Sung-Min Choi, Youngho Sihn, Jun-Yeop Lee, Min Suk Lee, Il-Kwon Jung, Taeseung Lee, Jun-Ki Lee, Young Taek Jee, Jong Hyuk Lee
Publikováno v:
Nuclear Engineering and Design. 365:110715
In this paper, a new system, which consists of mature and proven technologies, is suggested for simultaneous objectives in nuclear power plants: CHF enhancement and effective decontamination. It consists of multifunctional magnetic nanoparticles and