Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Jin-Won Joo"'
Autor:
Yeong-Jin Sagong, Jin-Won Joo
Publikováno v:
Journal of Industrial Science and Technology Institute. 35:31-36
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38f86fbeac3092246fd6fb3e88854f4d
https://doi.org/10.54726/jisti.35.1.6
https://doi.org/10.54726/jisti.35.1.6
Publikováno v:
Transactions of the Korean Society of Mechanical Engineers - A. 45:17-26
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63ea7da3e0df65ccdd7d377cc0d5e4b1
https://doi.org/10.3795/ksme-a.2021.45.1.017
https://doi.org/10.3795/ksme-a.2021.45.1.017
Autor:
Yeong-Jin Sagong, Jin-Won Joo
Publikováno v:
Journal of Industrial Science and Technology Institute. 34:23-28
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b1acfea7dbddc133970dea28b2c88a9a
https://doi.org/10.54726/jisti.34.1.5
https://doi.org/10.54726/jisti.34.1.5
Autor:
Hee-Joo Yang, Jin-Won Joo
Publikováno v:
Journal of Industrial Science and Technology Institute. 33:47-51
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::891984c5c3624910968c73452523b8cf
https://doi.org/10.54726/jisti.33.1.9
https://doi.org/10.54726/jisti.33.1.9
Publikováno v:
Transactions of the Korean Society of Mechanical Engineers - A. 42:1077-1086
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::497614048f1587d6a52e34af8eba3990
https://doi.org/10.3795/ksme-a.2018.42.12.1077
https://doi.org/10.3795/ksme-a.2018.42.12.1077
Autor:
Hong Sik Chung, Jin Won Joo
Publikováno v:
Transactions of the Korean Society of Mechanical Engineers A. 40:621-628
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ab9c2424af565aee08791ddc166af34
https://doi.org/10.3795/ksme-a.2016.40.7.621
https://doi.org/10.3795/ksme-a.2016.40.7.621
Autor:
Dong-Sun Lee, Jin-Won Joo
Publikováno v:
Journal of the Microelectronics and Packaging Society. 22:57-65
Department of Mechanical Engineering, Chungbuk National University, Cheongju 361-760, Korea(Received August 31, 2015: Corrected September 23, 2015: Accepted September 24, 2015)초록: 반도체 패키지는 여러 가지 다양한 재료로 구성되
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ce90b451311f0c2aa5cb0504adee299
https://doi.org/10.6117/kmeps.2015.22.3.057
https://doi.org/10.6117/kmeps.2015.22.3.057
Autor:
Jin Won Joo, Hee Gul Yang
Publikováno v:
Transactions of the Korean Society of Mechanical Engineers A. 38:1049-1056
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4dcfcfbba574fa2802df591c6dc5da56
https://doi.org/10.3795/ksme-a.2014.38.10.1049
https://doi.org/10.3795/ksme-a.2014.38.10.1049
Autor:
Man-Ki Kim, Jin-Won Joo
Publikováno v:
Journal of the Microelectronics and Packaging Society. 19:17-28
It is known that thermo-mechanical properties of solder material and molding compound in WB-PBGA packages are considerably affected by not only temperature but elapsed time. In this paper, finite element analysis (FEA) taking material nonlinearity in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ed749e7e1afd68eb93599f488223220
https://doi.org/10.6117/kmeps.2012.19.2.017
https://doi.org/10.6117/kmeps.2012.19.2.017
Publikováno v:
Microelectronics Reliability. 52:1128-1137
Quantification of the uncertainties in the material characterization of solder joint has been one of the major concerns in the microelectronics packaging industry to predict fatigue failure accurately. Therefore, in this study, a model calibration me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22d25d1e7998144c62ce706da0bcd65e
https://doi.org/10.1016/j.microrel.2012.01.008
https://doi.org/10.1016/j.microrel.2012.01.008