Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Jin-Kyu Jang"'
Autor:
Hyun-Jin Kim, Yeon-Hak Lee, Jin-Kyu Jang, Jae-Wook Choi, Su-Hyeon Choe, Sung-Bo Heo, Jun-Ho Kim, Daeil Kim
Publikováno v:
Journal of the Korean Society of Manufacturing Technology Engineers. 32:37-41
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::440615746199c36316a34640e9bdeeed
https://doi.org/10.7735/ksmte.2023.32.1.37
https://doi.org/10.7735/ksmte.2023.32.1.37
Autor:
Jin-Kyu Jang, Yun-Je Park, Yeon-Hak Lee, Jae-Wook Choi, Hyun-Jin Kim, Sung-Bo Heo, Young-Min Kong, Daeil Kim
Publikováno v:
Korean Journal of Metals and Materials. 60:668-672
Transparent and conductive ZnO 50 nm/Au 8 nm/ZnO 50 nm tri-layer films were deposited on poly-imide films by radio frequency (RF) and direct current (DC) magnetron sputtering at room temperature, and then the effect of electron irradiation on the cry
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dcfdc851291f2177963a94df1141fe42
https://doi.org/10.3365/kjmm.2022.60.9.668
https://doi.org/10.3365/kjmm.2022.60.9.668
Autor:
Su-Hyeon Choe, Jae-Wook Choi, Daeil Kim, Jin-Kyu Jang, Sung-Bo Heo, Young-Min Kong, Hyun-Jin Kim, Yu-Sung Kim
Publikováno v:
Journal of the Korean Society of Manufacturing Technology Engineers. 30:410-414
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91d1bb59960c8bcd06c4c5168cda329a
https://doi.org/10.7735/ksmte.2021.30.5.410
https://doi.org/10.7735/ksmte.2021.30.5.410
Autor:
Young-Min Kong, Sung-Bo Heo, Yu-Sung Kim, Daeil Kim, Jin-Kyu Jang, Su-Hyeon Choe, Jae-Wook Choi, Hyun-Jin Kim
Publikováno v:
Korean Journal of Metals and Materials. 59:545-550
Transparent and conductive Ti-doped In2O3 (TIO)/Ag/Ti-doped In2O3 (TAT) multilayer films were deposited on colorless poly imide (CPI) substrates by direct current (DC) and radio frequency (RF) magnetron sputtering at room temperature. During depositi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c29782adb3908bb40701de3e5f939bad
https://doi.org/10.3365/kjmm.2021.59.8.545
https://doi.org/10.3365/kjmm.2021.59.8.545
Autor:
Dong-Il Son, Daeil Kim, Sung-Bo Heo, Jea-Wook Choi, Dong-Hyuk Choi, Su-Hyeon Choe, Jin-Kyu Jang, Sun-Kyung Kim
Publikováno v:
Journal of the Korean Society of Manufacturing Technology Engineers. 29:497-502
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::438a1ebf80ca6596f7e7e40265b407bb
https://doi.org/10.7735/ksmte.2020.29.6.497
https://doi.org/10.7735/ksmte.2020.29.6.497
Autor:
Suhkmann Kim, Hea Jung Park, Do-Hoon Hwang, Seo Yul Kim, Youn Sang Bae, In Nam Kang, Jong Woon Ha, Dohyun Moon, Jin Kyu Jang
Publikováno v:
Inorganic chemistry. 56(20)
A new microporous Zr(IV)-based metal–organic framework (MOF) containing 4,4′,4″,4‴-(9,9′-spirobi[fluorene]-2,2′,7,7′-tetrayl)tetrabenzoic acid (Spirof-MOF) was synthesized, characterized, and size-controlled for the adsorption and decom
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3a5981bd068b3905a3f57eb5a0bec4da
https://pubmed.ncbi.nlm.nih.gov/28967745
https://pubmed.ncbi.nlm.nih.gov/28967745
Autor:
Jin-Kyu Jang, Jeong-Won Yoon, Hoo-Jeong Lee, Jinho Joo, Sang-Su Ha, Young Ho Kim, Sang-Ok Ha, Seung-Boo Jung
Publikováno v:
Microelectronic Engineering. 87:517-521
The effect of displacement rate and intermetallic compound (IMC) growth on the shear strength of electroplated Sn-2.5Ag (in wt.%) flip chip solder with Cu under-bump metallization (UBM) were investigated after multiple reflows. Cu"6Sn"5 IMC was forme
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::db097d534f2c47fd79e1d1521fda2bd1
https://doi.org/10.1016/j.mee.2009.07.015
https://doi.org/10.1016/j.mee.2009.07.015
Autor:
Jong-Woong Kim, Jin-Kyu Jang, Jeong-Won Yoon, Byung-Woo Kim, Seung-Boo Jung, Sun-Kyu Park, Sang-Su Ha, Sang-Ok Ha
Publikováno v:
Journal of Electronic Materials. 38:2489-2495
The traditional ball shear test is not suitable for evaluating joint reliability under drop loading, since the applied test speeds, usually lower than 5 mm/s, are well below the impact velocity applied to the solder joint in a drop test. The present
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::49303a5be70f8f7101060af97d1acaf9
https://doi.org/10.1007/s11664-009-0916-y
https://doi.org/10.1007/s11664-009-0916-y
Publikováno v:
International Journal of Modern Physics B. 23:1809-1815
The failure behaviors of flip chip solder joints under various loading conditions of the high-speed shear test (H-SST) were investigated with an experimental and non-linear 3-dimensional finite element modeling study. The solder composition used in t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2688492b344154916afeba9aa983fe8
https://doi.org/10.1142/s0217979209061664
https://doi.org/10.1142/s0217979209061664
Publikováno v:
Microelectronics Reliability. 48:1882-1889
High-speed ball shear test was investigated in terms of the effects of two test parameters, shear speed and shear height, with an experimental and computational simulation utilizing 3-dimensional non-linear finite element modeling for evaluating the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb8d79efbf7301192cab01a61355abb5
https://doi.org/10.1016/j.microrel.2008.07.066
https://doi.org/10.1016/j.microrel.2008.07.066