Zobrazeno 1 - 10
of 12
pro vyhledávání: '"Jin-Ki Cho"'
Autor:
Seong-Jin Kim, Joon Jeong, Jin Ki Cho, WonJoo Kim, Jeong-Mi Lee, YunShin Jung, Kyung-Min Yang
PDF file - 1706K, Supplementary Fig. S1. TBK1 knockdown increases cell migration. Supplementary Fig. S2. TBK1 knockdown increases cell invasion. Supplementary Fig. S3. TBK1 knockdown did not inhibit the expression of ERalpha proteins via the proteaso
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3a050c6c48908579fffa35ab0dd93433
https://doi.org/10.1158/0008-5472.22398042.v1
https://doi.org/10.1158/0008-5472.22398042.v1
Publikováno v:
Journal of the Korean institute of surface engineering. 48:253-259
The test equipment becomes more important with the development of semiconductor industry. MEMS probe is an important testing component to detect the defects from the generated electric signal when it contacts the metal pad of semiconductor devices. N
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::291a3ec5e8e889262cdb9dea2efa0a80
https://doi.org/10.5695/jkise.2015.48.6.253
https://doi.org/10.5695/jkise.2015.48.6.253
Autor:
WonJoo Kim, Seong-Jin Kim, Jin Ki Cho, Kyung Min Yang, Joon Jeong, Yun Shin Jung, Jeong Mi Lee
Publikováno v:
Cancer Research. 73:6679-6689
Estrogen receptor α (ERα) is the pivotal regulator of proliferation and differentiation in mammary epithelia, where it serves as a crucial prognostic marker and therapeutic target in breast cancer. In this study, we show that the loss of the kinase
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::271e11bbba00c61268a12219b1f2a384
https://doi.org/10.1158/0008-5472.can-13-0891
https://doi.org/10.1158/0008-5472.can-13-0891
Autor:
Jin-Ki Cho, Hyun-Chul Yu
Publikováno v:
Journal of the Korean institute of surface engineering. 46:158-161
Recently, the weight reduction and miniaturization of the electronics have placed great emphasis. The miniaturization of PCB (Printed Circuit Board) as main component among the electronic components has also become progressed. The use of acid copper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d3b365c6bf8c14c29dcc6f027f82f691
https://doi.org/10.5695/jkise.2013.46.4.158
https://doi.org/10.5695/jkise.2013.46.4.158
Autor:
Jin Ki Cho, Min Hyeong Lee
Publikováno v:
Journal of the Korean institute of surface engineering. 46:153-157
The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Fillin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c6b0a20ae3bb2e0ab91e0067301ad9b
https://doi.org/10.5695/jkise.2013.46.4.153
https://doi.org/10.5695/jkise.2013.46.4.153
Autor:
Joon-Shik Park, Jin-Ki Cho, C.S. Yoon, Gil-Ho Hwang, Sung-Goon Kang, Seok-Jun Hong, Won-Kyu Han
Publikováno v:
Applied Surface Science. 255:6082-6086
Continuous electroless deposition of a 10-nm thick layer of Cu was successfully performed on a SiO2/Si substrate coated with a 3-nm Au catalytic layer. The Au catalytic layer was formed by a self-assembled monolayer (SAM) process terminated with NH2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6648b55f91a85af5af1a1211813843f7
https://doi.org/10.1016/j.apsusc.2009.01.037
https://doi.org/10.1016/j.apsusc.2009.01.037
Publikováno v:
MRS Proceedings. 977
Format This is a copy of the slides presented at the meeting but not formally written up for the volume. Abstract Recent advancements in various industries have necessitated the development of new engineering materials exhibiting superior properties
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aed694dd72abeb0d365bca9c8bd9a421
https://doi.org/10.1557/proc-977-0977-ff04-12
https://doi.org/10.1557/proc-977-0977-ff04-12
Autor:
So-Jin Kim, Jeong-Woon Ju, Seung-Jin Yeom, Noh-Jung Kwak, Won-Kyu Han, Jin-Ki Cho, Jinwoong Kim, Jae Hong Kim, Sung-Goon Kang
Publikováno v:
Korean Journal of Materials Research. 19:61~67-61~67
Electrolessly deposited Co (Re,P) was investigated as a possible capping layer for Cu wires. 50 nm Co (Re,P) films were deposited on Cu/Ti-coated silicon wafers which acted as a catalytic seed and an adhesion layer, respectively. To obtain the optimi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::927b4ba33ec7658641b4ddbf31ac0c19
https://doi.org/10.3740/mrsk.2009.19.2.061
https://doi.org/10.3740/mrsk.2009.19.2.061
Autor:
Gil-Ho Hwang, Sung-Goon Kang, Seok-Jun Hong, Won-Kyu Han, Jin-Ki Cho, Yong-Ho Choa, Sung-Tag Oh
Publikováno v:
Korean Journal of Materials Research. 18:457~462-457~462
Through the electrostatic interaction between the poly-diallydimethylammonium chloride (PDDA) modified Multi-walled carbon nanotube (MWNT) and suspension in 1mM solution, MWNT- nanocomposites (MSC) for anode electrodes of a Li-ion battery were succes
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67b677d0a90aac6f7b85570185e77380
https://doi.org/10.3740/mrsk.2008.18.9.457
https://doi.org/10.3740/mrsk.2008.18.9.457
Preparation and Characteristics of MWNT/SnO₂Nano-Composite Anode by Homogeneous Precipitation Method
Publikováno v:
Korean Journal of Materials Research. 18:187~192-187~192
Multi-walled carbon nanotube (MWNT)/SnO2 nano-composite (MSC) for the anode electrode of a Li-ion battery was prepared using a homogeneous precipitation method with SnCl2 precursors in the presence of MWNT. XRD results indicate that when annealed in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2eaafa5ac150df30e6811a949418bbd7
https://doi.org/10.3740/mrsk.2008.18.4.187
https://doi.org/10.3740/mrsk.2008.18.4.187