Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Jin-Hyuk Gang"'
Publikováno v:
International Journal of Aeronautical and Space Sciences. 17:565-578
A probabilistic based systems approach is addressed in this study for the reliability prediction of solid rocket motors (SRM). To achieve this goal, quantitative Failure Modes, Effects and Criticality Analysis (FMECA) approach is employed to determin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e76ed10341b5f66300184008d89b5e3b
https://doi.org/10.5139/ijass.2016.17.4.565
https://doi.org/10.5139/ijass.2016.17.4.565
Publikováno v:
Transactions of the Korean Society of Mechanical Engineers B. 37:313-322
Batteries, which are being used as energy sources in various applications, tend to degrade, and their capacity declines with repeated charging and discharging cycles. A battery is considered to fail when it reaches 80% of its initial capacity. To pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b714a967b0a1f6dd616c57071ac8f6d4
https://doi.org/10.3795/ksme-b.2013.37.4.313
https://doi.org/10.3795/ksme-b.2013.37.4.313
Publikováno v:
Microelectronics Reliability. 52:1128-1137
Quantification of the uncertainties in the material characterization of solder joint has been one of the major concerns in the microelectronics packaging industry to predict fatigue failure accurately. Therefore, in this study, a model calibration me
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22d25d1e7998144c62ce706da0bcd65e
https://doi.org/10.1016/j.microrel.2012.01.008
https://doi.org/10.1016/j.microrel.2012.01.008
Publikováno v:
Microelectronics Reliability. 51:985-993
The effects of material properties modeling on the solder failure analyses by numerical simulations are studied. The packaging structure of plastic ball grid array on printed circuit board was modeled. Two different types of molding compounds and two
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::266cb91b8e132fa24a037819562d8af8
https://doi.org/10.1016/j.microrel.2010.12.014
https://doi.org/10.1016/j.microrel.2010.12.014
Publikováno v:
Transactions of the Korean Society of Mechanical Engineers A. 34:1377-1384
The objective of this study is to determine the best material model that represents the deformation behavior of the Sn37Pb solder alloy accurately. First, a specimen is fabricated and subjected to a thermal cycle with temperatures ranging from the ro
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1aa914e1978530102c444bfc43fb8933
https://doi.org/10.3795/ksme-a.2010.34.10.1377
https://doi.org/10.3795/ksme-a.2010.34.10.1377
Publikováno v:
Transactions of the Korean Society of Mechanical Engineers A. 32:1132-1139
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45fda98570c24221c99384e5635aa762
https://doi.org/10.3795/ksme-a.2008.32.12.1132
https://doi.org/10.3795/ksme-a.2008.32.12.1132
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
The effects of material properties modeling on the solder failure analyses by numerical simulations are studied. The packaging structure of plastic ball grid array on printed circuit board was modeled. Two different types of molding compounds and two
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fc5100ee4ab8a5539e563b30cab078d5
https://doi.org/10.1109/eptc.2010.5702717
https://doi.org/10.1109/eptc.2010.5702717
Publikováno v:
2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).
The objective of this study is to analyze warpage development mechanism by simulating a strip type packaging for plastic ball grid array. Molding compound and substrate materials were thermo-mechanically tested to obtain the mechanical properties by
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::52fc11e0b24ab5f9c819e855834da9bf
https://doi.org/10.1109/esime.2010.5464527
https://doi.org/10.1109/esime.2010.5464527
Publikováno v:
Volume 3: 30th Computers and Information in Engineering Conference, Parts A and B.
In this study, a method of computer model calibration is applied to quantify the uncertainties arising in the material characterization of the solder joint in the microelectronics package subject to a thermal cycle. In this study, all uncertainties a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f1a7e0760ceee8f47426e3f2ca92bba
https://doi.org/10.1115/detc2010-28603
https://doi.org/10.1115/detc2010-28603
Publikováno v:
2010 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2010, p1-7, 7p