Zobrazeno 1 - 10
of 115
pro vyhledávání: '"Jin-Hua Hong"'
Publikováno v:
2022 IEEE International Test Conference in Asia (ITC-Asia).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2100724ed887cea77aac85d208899a75
https://doi.org/10.1109/itcasia55616.2022.00011
https://doi.org/10.1109/itcasia55616.2022.00011
Autor:
Jin-Hua Hong, Bin-Yan Tsai
Publikováno v:
APCCAS 2006 - 2006 IEEE Asia Pacific Conference on Circuits & Systems; 2006, p1446-1449, 4p
Autor:
Wei-Ling Yi, Jin-Hua Hong
Publikováno v:
FSKD
A 3rd-order single-bit sigma-delta modulator is designed using TSMC 0.35-µm 2P4M process, which achieves a 97-dB SNR in a signal bandwidth of 20 kHz and with a sampling frequency of 5.12 MHz. The modulator is implemented by a fully-differential swit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54c16546f793405eca932c38e32596a7
https://doi.org/10.1109/fskd.2015.7382249
https://doi.org/10.1109/fskd.2015.7382249
Autor:
Jin-Hua Hong, Wei-Ling Yi
Publikováno v:
2015 12th International Conference on Fuzzy Systems & Knowledge Discovery (FSKD); 2015, p1961-1965, 5p
Autor:
Jin-Hua Hong, Cheng-Wen Wu
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 11:474-484
We propose a radix-4 modular multiplication algorithm based on Montgomery's algorithm, and a fast radix-4 modular exponentiation algorithm for Rivest, Shamir, and Adleman (RSA) public-key cryptosystem. By modifying Booth's algorithm, a radix-4 cellul
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::345bb63d9825ac2641fef09957b0f551
https://doi.org/10.1109/tvlsi.2003.812308
https://doi.org/10.1109/tvlsi.2003.812308
Autor:
Zong-Yi Chen, Jin-Hua Hong
Publikováno v:
MWSCAS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1eb1dfde7c6bf4bafc74702f0cad93c4
https://doi.org/10.1109/mwscas.2014.6908549
https://doi.org/10.1109/mwscas.2014.6908549
Publikováno v:
VLSI-DAT
Three-dimensional integration is considered a promising solution to cure the challenges of performance, power consumption, quality, and reliability issues. The feature of 2.5D ICs is that the dies are stacked on a passive silicon interposer and the d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbbe2bc6d39e9edf5658febc5f5ac695
https://doi.org/10.1109/vlsi-dat.2014.6834878
https://doi.org/10.1109/vlsi-dat.2014.6834878
Publikováno v:
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 8:503-516
An IEEE 1149.5 module test and maintenance (MTM) bus slave module interface core is presented, which is used for direct access from the system bus to the IEEE 1149.1 chip-level or on-chip buses to facilitate hierarchical system test and diagnosis. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d126dd8a7f632d5714ca07c3e0aac0f2
https://doi.org/10.1109/92.894154
https://doi.org/10.1109/92.894154
Publikováno v:
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 17:724-736
A fast fault simulation approach based on ordinary logic emulation is proposed. The circuit configured into our system that emulates the faulty circuit's behaviour is synthesized from the good circuit and the given fault list in a novel way. Fault in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5c72d80084d12890136fad93c3cd1424
https://doi.org/10.1109/43.712103
https://doi.org/10.1109/43.712103
Autor:
Jin-Hua Hong, Cheng-Chang Yu, Kai-Feng Huang, Ming Chang Shih, Yu-Ting Hsu, Wen-How Lan, Chien-Jung Huang
Publikováno v:
Journal of Nanomaterials, Vol 2013 (2013)
ZnO thin film was fabricated by thermally oxidized Zn at 600°C for 1 h. A surface containing nanostructured dumbbell and lines was observed by scanning electron microscope (SEM). The ZnO resistor device was formed after the following Ti/Au metalliza
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d9fc727e16aa68dc409c44fdec9fd613
https://doaj.org/article/28a5faa62f4247858c7dfe444e995bc8
https://doaj.org/article/28a5faa62f4247858c7dfe444e995bc8