Zobrazeno 1 - 10
of 15
pro vyhledávání: '"Jin Young Khim"'
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abb229b47470469f93a0ed2c78f35218
https://doi.org/10.1109/ectc51906.2022.00054
https://doi.org/10.1109/ectc51906.2022.00054
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e23ee3705ef4c8d987b444ed192c29e
https://doi.org/10.1109/ectc51906.2022.00238
https://doi.org/10.1109/ectc51906.2022.00238
Autor:
Jin Young Khim, Muhammad Hadhari Hazellah, HyeongIl Jeon, Kim Byong Jin, Weng Tuck Chim, Dong Su Ryu
Publikováno v:
2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
Most power packages still use a high-lead (Pb) solder paste because the high-Pb solder paste has the advantage of no re-melt during the printed circuit board (PCB) reflow process as well as good wettability and high reliability performance. There are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::adc500f3c082ea259ad044b8650f6b21
https://doi.org/10.1109/ectc.2019.00224
https://doi.org/10.1109/ectc.2019.00224
Autor:
Min Lee, Ji-Young Lee, Jin Young Khim, Juneyoung Lee, Myung Hee Nam, Jong Bok Seo, Donggeun Sul, Zhi Zheng, So Young Park, Sohee Phark, Eunkyung Jo, Seonyoung Choi, Sangnam Oh, Eunil Lee, Woon Won Jung
Publikováno v:
PROTEOMICS. 9:1827-1840
In this study, various solvent systems were applied to obtain a high and consistent recovery rate of low molecular weight plasma proteins (LMPP) from human plasma. A buffer system containing 7 M urea, 2 M thiourea, 25 mM NH(4)HCO(3) + 20% ACN (pH 8.2
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e15235c939534e9bcc9d3909fb32ade9
https://doi.org/10.1002/pmic.200800470
https://doi.org/10.1002/pmic.200800470
Publikováno v:
IEEE Transactions on Electronics Packaging Manufacturing. 30:42-48
As handheld electronic products are more prone to being dropped during useful life, package to board interconnect reliability has become a major concern for these products. This has prompted the industry to evaluate the drop performance of CSP packag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ffea311e595e3e297554559acfee8ebd
https://doi.org/10.1109/tepm.2006.890644
https://doi.org/10.1109/tepm.2006.890644
Autor:
TaeSeong Kim, SangHyun Ryu, GiSong Lee, Jesse Galloway, YunHyeon Ka, Ahmer Syed, J. Cannis, Seungmo Kim, Jin Young Khim, WonJoon Kang
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 28:297-302
Ball grid array (BGA) package styles use solder balls as an electrical interconnect between packages and application boards. Solder balls are rigid and tend to fracture under thermal fatigue and/or shock loading. Metalized polymer spheres (MPS) offer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::01f7a2fb6db11ce4c4460f73762e1ac5
https://doi.org/10.1109/tcapt.2005.848504
https://doi.org/10.1109/tcapt.2005.848504
Publikováno v:
56th Electronic Components and Technology Conference 2006.
According as high density packaging options such as 2 or more die stacking or package stacking technologies are developed, the major mold process related quality concerns such as incomplete mold, exposed wires and wire sweeping are increased because
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4433ce13a69c34b008b85a4be3cb5c2
https://doi.org/10.1109/ectc.2006.1645780
https://doi.org/10.1109/ectc.2006.1645780
Autor:
Younghwan Kim, Hyung Sik Kang, Nam Hee Won, Jin Young Khim, Eunha Oh, Hyun-Suk Kim, Hosub Im, Woon Won Jung, Joohee Mun, Eunil Lee, Eunmi Kim, Donggeun Sul
Publikováno v:
Journal of proteome research. 5(6)
Formaldehyde (FA) is known as a low molecule weight organic compound and one of major components that causes sick building syndrome (SBS), and it has been reported that FA has cytotoxic, hemotoxic, immunotoxic, and genotoxic properties. The Internati
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0ba516d78c5a295a8c8c8f0f30a19e8f
https://pubmed.ncbi.nlm.nih.gov/17022623
https://pubmed.ncbi.nlm.nih.gov/17022623
Autor:
Joohee Mun, Heezoo Kim, Jin Young Khim, Sang Ho Lim, Donggeun Sul, Mi Kyoung Lee, Hosub Im, Minho Yang, Eunha Oh, Myoung Hoon Kong, Eunil Lee
Publikováno v:
Toxicology. 220(2-3)
DNA damage, lipid peroxidation and protein oxidation were evaluated in rats exposed to a 1% isoflurane atmosphere with or without alcohol administration (administrated by gastric intubation at 4 g/kg body weight as a 50% solution). Single cell gel el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::196771c823afc3b3c2c9f0283de0c232
https://pubmed.ncbi.nlm.nih.gov/16442689
https://pubmed.ncbi.nlm.nih.gov/16442689
Autor:
A. Syed, null Seung Mo Kim, null Wei Lin, null Jin Young Khim, null Eun Sook Song, null Jae Hyeon Shin, T. Panczak
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::141d0ad755e863880609cae1567b19eb
https://doi.org/10.1109/ectc.2005.1441308
https://doi.org/10.1109/ectc.2005.1441308