Zobrazeno 1 - 10
of 114
pro vyhledávání: '"Jimmy Hsu"'
Publikováno v:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1dd8d6f17337d0f402d9b96823f13452
https://doi.org/10.1109/impact56280.2022.9966636
https://doi.org/10.1109/impact56280.2022.9966636
Autor:
Shijuan Qin, Patt Chang, Falconee Lee, Thonas Su, Denis Chen, Ariel Guo, Weijie Yuan, Mark Cao, Aje Chang, Donald Fan, Yl Li, Jimmy Hsu, Kevin Liang, Bryant Tsai, Kate Tzeng
Publikováno v:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b37f421bad55d4414dab4b51bb25f31
https://doi.org/10.1109/impact56280.2022.9966679
https://doi.org/10.1109/impact56280.2022.9966679
Publikováno v:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::78cd2700e4666bf921760e417406b689
https://doi.org/10.1109/impact56280.2022.9966724
https://doi.org/10.1109/impact56280.2022.9966724
Autor:
Jimmy Hsu, Kuan-Ting Wu, Brian Ho, Lemon Lin, Betty Chen, Thonas Su, Steven Wu, Gary Hung, Jim Tseng
Publikováno v:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abf2d8df1d5670c24e41648c17c4942f
https://doi.org/10.1109/impact56280.2022.9966635
https://doi.org/10.1109/impact56280.2022.9966635
Publikováno v:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bbd728131bd4ab5880f6715da6fc8caf
https://doi.org/10.1109/impact56280.2022.9966699
https://doi.org/10.1109/impact56280.2022.9966699
Publikováno v:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6751ea5561f4e32486df313674125984
https://doi.org/10.1109/impact56280.2022.9966687
https://doi.org/10.1109/impact56280.2022.9966687
Publikováno v:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d2220dbd3095f7bfaa97929a53bf36e
https://doi.org/10.1109/impact56280.2022.9966709
https://doi.org/10.1109/impact56280.2022.9966709
Autor:
Jimmy Hsu, Leo Lee, Eric Hsiao, Joseph Yang, Dian-Ying Wu, Jay Wu, Dong-Han Wu, Tina Yang, Denis Chen
Publikováno v:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b30c9c00c200440b001a6301b099cfc6
https://doi.org/10.1109/impact56280.2022.9966703
https://doi.org/10.1109/impact56280.2022.9966703
Publikováno v:
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e0db6374ba8576f274c278b32a4f7279
https://doi.org/10.1109/impact56280.2022.9966680
https://doi.org/10.1109/impact56280.2022.9966680
Publikováno v:
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf3df749b6a103fe6d4b706da464f71b
https://doi.org/10.1109/apemc53576.2022.9888577
https://doi.org/10.1109/apemc53576.2022.9888577