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Publikováno v:
3DIC
While several methods are available and in production for power devices, LED or other markets, 200mm and 300mm temporary bonding for 3D integration is a quite new field for material and equipment suppliers and challenging all participants in the supp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::25cf7a13ed731ed550aaf26cdb772783
https://doi.org/10.1109/3dic.2010.5751478
https://doi.org/10.1109/3dic.2010.5751478
Autor:
Reza Ghodssi, Pinyen Lin
MEMs Materials and Processes Handbook'is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on'Ma
