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pro vyhledávání: '"Jim Hee Low"'
Autor:
Hun Shen Ng, R. Moody, Tong Yan Tee, Long BinTan, Choong Peng Khoo, Jim Hee Low, Rex Anderson, Boyd Rogers
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
The Wafer Level Chip Scale Package (WLCSP) is gaining popularity for its performance and for its ability to meet miniaturization requirements of portable consumer electronics, such as cell phones. Due to differential bending between the silicon die a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42bd4b88f0452bedcead35c6061de45c
https://doi.org/10.1109/eptc.2008.4763574
https://doi.org/10.1109/eptc.2008.4763574
Autor:
Geok-Leong Tan, Chuan-Yau Hoo, Thiam-Beng Lim, Nam-Beng Tay, K.K. Chakravorty, Jim-Hee Low, Gerard Chew
Publikováno v:
1996 Proceedings 46th Electronic Components and Technology Conference.
As interest in BGA packaging continues to surge in the industry, many companies are evaluating the package for immediate and future use. Evaluation and acceptance of new packages take time. Furthermore, standards are required to benchmark new package
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a1638c8045ea5c3a17c803d7169bed6
https://doi.org/10.1109/ectc.1996.517459
https://doi.org/10.1109/ectc.1996.517459
Autor:
Tong Yan Tee, Long BinTan, Anderson, R., Hun Shen Ng, Jim Hee Low, Choong Peng Khoo, Moody, R., Rogers, B.
Publikováno v:
2008 10th Electronics Packaging Technology Conference; 2008, p1086-1095, 10p
Autor:
Geok-Leong Tan, Chuan-Yau Hoo, Gerard Chew, Jim-Hee Low, Nam-Beng Tay, Chakravorty, K.K., Thiam-Beng Lim
Publikováno v:
1996 Proceedings 46th Electronic Components & Technology Conference; 1996, p687-693, 7p
Conference
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