Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Jim Blanche"'
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 28:457-466
Fine-pitch ball grid arrays (BGAs) and underfills have been used in benign office environments and wireless applications for a number of years, however their reliability in harsh environments is not well understood. In this work, the design guideline
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d2abb6562d5c37e59e79707b0f89bc7c
https://doi.org/10.1109/tcapt.2005.854162
https://doi.org/10.1109/tcapt.2005.854162
Publikováno v:
Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B.
The effect of temperature exposure encountered both during assembly and in fielded products, has a known influence on glass transition temperature of printed-circuit board (PCB) laminate materials. Printed circuit board laminates such as FR4 are comp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fbf12c0371b10da5d77b94bb5f5920d
https://doi.org/10.1115/imece2012-93057
https://doi.org/10.1115/imece2012-93057
Publikováno v:
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.
The effect of temperature exposure encountered both during assembly and in fielded products, has a known influence on glass transition temperature of printed-circuit board (PCB) laminate materials. Printed circuit board laminates such as FR4 are comp
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c5c8c0903fbba9311abd84f67c689b3
https://doi.org/10.1109/itherm.2012.6231439
https://doi.org/10.1109/itherm.2012.6231439
Autor:
Pradeep Lall, Jim Blanche, Mark Strickland, Dave Geist, Kewal Patel, Ryan Lowe, Randall Montgomery
Publikováno v:
2012 IEEE 62nd Electronic Components and Technology Conference.
Electronics in aerospace applications may be subjected to very high g-loads during normal operation. A novel micro-coil array interconnect has been studied for increased reliability during extended duration aerospace missions in presence of high-g lo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43431984798725bd0085ca25ee6cdb57
https://doi.org/10.1109/ectc.2012.6248988
https://doi.org/10.1109/ectc.2012.6248988
Autor:
Jeffrey C. Suhling, Dineshkumar Arunachalam, Mark Strickland, Jim Blanche, Pradeep Lall, Aniket Shirgaokar
Publikováno v:
ASME 2009 InterPACK Conference, Volume 2.
Goldmann Constants and Norris-Landzberg acceleration factors for lead-free solders have been developed based on principal component regression models (PCR) for reliability prediction and part selection of area-array packaging architectures under ther
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3252a9be97ef39e903fa347c77bf2cdf
https://doi.org/10.1115/interpack2009-89329
https://doi.org/10.1115/interpack2009-89329
Autor:
Pradeep Lall, M. Kaysar Rahim, Roy W. Knight, Jeffrey C. Suhling, Mark Strickland, Richard C. Jaeger, Jim Blanche
Publikováno v:
Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..
Electronic assemblies are approximately "stress free" near their assembly temperature, which is typically above 150 degC when encapsulants and solders are involved. As the assemblies are cooled below room temperature, the temperature difference betwe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::385463432ad84ace143f82fb8c89a409
https://doi.org/10.1109/itherm.2006.1645506
https://doi.org/10.1109/itherm.2006.1645506
Autor:
Pradeep Lall, Ganesh Hariharan, Jeffrey C. Suhling, Jim Blanche, Guoyun Tian, Mark Strickland
Publikováno v:
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology.
In this work, risk-management and decision-support models for reliability prediction of flip chip packages in harsh environments have been presented. The models presented in this paper provide decision guidance for smart selection of component packag
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb06d2acb97b32b3dd820b7694e9ec08
https://doi.org/10.1115/imece2006-15443
https://doi.org/10.1115/imece2006-15443
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Modeling tools and techniques for assessment of component reliability in extreme environments are scarce. Previous studies have focused on development of modeling tools at sub-scale or component level. The tools are often available only in an offline
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9cc73ead6bbc7fe71254bb4ee9f3a41d
https://doi.org/10.1109/ectc.2005.1441257
https://doi.org/10.1109/ectc.2005.1441257
Autor:
M. Kaysar Rahim, Hongtao Ma, Chang Lin, M. Saiful Islam, Mark Strickland, Pradeep Lall, Jeffrey C. Suhling, Richard C. Jaeger, Roy W. Knight, Jim Blanche
Publikováno v:
Advances in Electronic Packaging, Parts A, B, and C.
High stresses in semiconductor die and other packaging elements can be developed in electronic assemblies subjected to extremely low ambient temperatures leading to reliability concerns. In this work, we have characterized and modeled the silicon die
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::272fce38de9e1d9556fcc4d2a6c3b3ec
https://doi.org/10.1115/ipack2005-73349
https://doi.org/10.1115/ipack2005-73349
Publikováno v:
The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
Fine-Pitch BGAs and underfills have been used in benign office environments and wireless applications for a number of years, however their reliability in harsh environments is not well understood. In this work, the design guidelines development effor
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eae6531abe096ce99c27db1e6f51e3da
https://doi.org/10.1109/itherm.2004.1318291
https://doi.org/10.1109/itherm.2004.1318291