Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Jifei Sang"'
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 6, Pp 755-759 (2018)
Due to low dielectric loss and low cost, glass is developed as a promising material for advanced interposers in 2.5-D and 3-D integration. In this paper, through glass vias (TGVs) are used to implement inductors for minimal footprint and large qualit
Externí odkaz:
https://doaj.org/article/fdb8f602845349b6be99c499461fe55b
Publikováno v:
IEEE Transactions on Antennas and Propagation. :1-1
Publikováno v:
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
Based on extracted equivalent circuit parameters, this paper established the power delivery network model of carbon-based three-dimensional (3-D) integration and derived analytical formulas to predict the voltage drop in the proposed 3-D circuit, in
Publikováno v:
2017 Progress in Electromagnetics Research Symposium - Fall (PIERS - FALL).
This paper established the physical structure of through glass via (TGV) based inductors and investigated the effect of TGV design parameters on the electrical performance of this kind of inductor with the full-wave full-wave electromagnetic field si
Publikováno v:
Journal of Semiconductors; Dec2018, Vol. 39 Issue 12, p1-1, 1p