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Akademický článek

Study on the Manufacturability of X Dimension Fan Out Integration Package with Organic RDLs (XDFOI-O).

Autor: Haijie Chen, Ziyao Bian, Tao Liu, Jielei Xie, Jingyu Wu, Yaojian Lin, Choon Heung Lee

Publikováno v: Journal of Microelectronic & Electronic Packaging; 2024, Vol. 21 Issue 1, p14-19, 6p

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Study on CPI behaviors of X Dimension Fan-Out Integration (XDFOI) packages

Autor: Haijie Chen, Zhen Hu, Chen Wang, Ming He, Jielei Xie, Yaojian Lin, Choon Heung Lee

Publikováno v: IMAPSource Proceedings. 2022

XDFOITM (X Dimension Fan Out Integration) is a package family designed for fan out packages and heterogeneous integration, as XDFOI offers great flexibility to let single die or multi-functional chips, such as logic, memory, power management, RF and

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2dca6e3939361277ea2c4d16fb3c8392
https://doi.org/10.4071/001c.74581

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Periodical

Study on the Manufacturability of XDFOI Package with Organic RDLs (XDFOI-O).

Autor: Haijie Chen, Ziyao Bian, Tao Liu, Jielei Xie, Jingyu Wu, Yaojian Lin, Choon Heung Lee

Publikováno v: Advancing Microelectronics; 2024, Vol. 51 Issue 4, p26-31, 6p

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