Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Jieda Li"'
Publikováno v:
ISCAS
Advanced nanoscale Very Large Scale Integrated (VLSI) circuits are facing significant timing closure challenges especially due to random on-chip threshold voltage variation. When dealing with the exaggerated timing issues in nanoscale technologies, c
Autor:
Jin Yao, Ron Ho, Ivan Shubin, Ying Luo, Xuezhe Zheng, Frankie Liu, Guoliang Li, Hiren D. Thacker, Joannes M. Costa, Thierry Pinguet, Kannan Raj, Jon Lexau, Mehdi Asghari, Ashok V. Krishnamoorthy, James G. Mitchell, John E. Cunningham, Dinesh Patil, Dazeng Feng, Jieda Li
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Oracle's scalable hybrid integration technology platform enables continuing improvements in performance and energy efficiency of photonic bridge chips by leveraging advanced CMOS technologies with maximum flexibility, which is critical for developing
Autor:
Ron Ho, Dinesh Patil, Thierry Pinguet, Ying Luo, Hiren D. Thacker, Xuezhe Zheng, John E. Cunningham, Frankie Liu, Attila Mekis, Mehdi Asghari, Ashok V. Krishnamoorthy, Jon Lexau, Michael Dayringer, Hesam Fathi Moghadam, Po Dong, Guoliang Li, Jon Gainsley, Kannan Raj, Philip Amberg, Jin Yao, Ivan Shubin, Elad Alon, Dazeng Feng, Jieda Li
Publikováno v:
Optics express. 19(6)
Using low parasitic microsolder bumping, we hybrid integrated efficient photonic devices from different platforms with advanced 40 nm CMOS VLSI circuits to build ultra-low power silicon photonic transmitters and receivers for potential applications i
Publikováno v:
Scopus-Elsevier
Optical properties of Titanium in-diffused LiNbO3 waveguide have been related to the structural properties by Secondary Ion Mass Spectroscopy (SIMS) and Beam Propagation Method (BPM). The comparison of mode diameters obtained from BPM calculation and
Autor:
Thacker, H.D., Shubin, I., Ying Luo, Costa, J., Lexau, J., Xuezhe Zheng, Guoliang Li, Jin Yao, Jieda Li, Patil, D., Liu, F., Ho, R., Dazeng Feng, Asghari, M., Pinguet, T., Raj, K., Mitchell, J.G., Krishnamoorthy, A.V., Cunningham, J.E.
Publikováno v:
2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p829-835, 7p