Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Jie-Rong Lu"'
Publikováno v:
Advanced Materials Research. :929-934
An electro-thermo coupling finite element model is developed to investigate the electromigration and electro-thermo-mechanical effects on electronic packaging. Sn4.0Ag0.6Cu (SAC405) solder ball are commonly used on POP package in this research. Curre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::495343c188d80e87574b09749ca8660d
https://doi.org/10.4028/www.scientific.net/amr.126-128.929
https://doi.org/10.4028/www.scientific.net/amr.126-128.929
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging.
An electro-thermo coupling finite element model for lead free Sn4.0Ag0.5Cu (SAC405) solder ball is developed to investigate the electromigration and electro-thermo-mechanical effects on electronic packaging in the present paper. SAC405 alloy solder b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c0325625da55ca1df91e3051e0e9ba15
https://doi.org/10.1109/icept.2010.5582842
https://doi.org/10.1109/icept.2010.5582842
Publikováno v:
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
A comprehensive integrated electro-thermo coupling model is developed to investigate the electro-thermo-mechanical effects and electromigration analysis on Package-on-Package (POP) in this paper. POP packaging involves in ultra thin gold wire (φ=1mi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62b79c1c193be794af2d5aad9744ee46
https://doi.org/10.1109/impact.2009.5382299
https://doi.org/10.1109/impact.2009.5382299
Publikováno v:
2009 International Conference on Electronic Packaging Technology & High Density Packaging.
In this paper, an advanced electro-thermo coupling model is developed to investigate the electromigration and electrothermo-mechanical effects on electronic packaging, especially on Package-on-Package (POP). POP packaging involves in ultra thin gold
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::418398a7fd05204192c6a9b8fd6226b2
https://doi.org/10.1109/icept.2009.5270595
https://doi.org/10.1109/icept.2009.5270595
Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball.
Publikováno v:
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2010, p724-729, 6p
Publikováno v:
2009 International Conference on Electronic Packaging Technology & High Density Packaging; 2009, p1113-1118, 6p
Publikováno v:
2009 4th International Microsystems, Packaging, Assembly & Circuits Technology Conference; 2009, p23-26, 4p