Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Jie-Fei Zhu"'
Autor:
Guang-Yue Wang, Jing-Fei Zhu, Qi-Chao Wang, Jia-Xin Qin, Xin-Lei Wang, Xing Liu, Xin-Yu Liu, Jun-Zhi Chen, Jie-Fei Zhu, Shi-Chao Zhuo, Di Wu, Na Li, Liu Chao, Fan-Lai Meng, Hao Lu, Zhen-Duo Shi, Zhi-Gang Jia, Cong-Hui Han
Publikováno v:
Scientific Reports, Vol 14, Iss 1, Pp 1-11 (2024)
Abstract We aimed to build a deep learning-based pathomics model to predict the early recurrence of non-muscle-infiltrating bladder cancer (NMIBC) in this work. A total of 147 patients from Xuzhou Central Hospital were enrolled as the training cohort
Externí odkaz:
https://doaj.org/article/dff663ef0c3c4716a9060e5890293bfd
Autor:
Zhen‐Duo Shi, Zhuo Sun, Zuo‐Bin Zhu, Xing Liu, Jun‐Zhi Chen, Lin Hao, Jie‐Fei Zhu, Kun Pang, Di Wu, Yang Dong, Yu‐Fei Liu, Wei‐Hua Chen, Qing Liang, Shi‐Chao Zhuo, Cong‐Hui Han
Publikováno v:
Clinical and Translational Medicine, Vol 13, Iss 7, Pp n/a-n/a (2023)
Abstract Background Recurrent bladder cancer is the most common type of urinary tract malignancy; nevertheless, the mechanistic basis for its recurrence is uncertain. Innovative technologies such as single‐cell transcriptomics and spatial transcrip
Externí odkaz:
https://doaj.org/article/336ecc3905af4a5baef9c9ddd2f7d953
Publikováno v:
2017 18th International Conference on Electronic Packaging Technology (ICEPT).
In this study, core-shell structured SiO 2 @Ag submicro-sized spheres were prepared and used to improve the performance of the micro-sized silver flakes filled electrically conductive adhesive (ECA). The silica cores with an average diameter of 400 n
Publikováno v:
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
In the present study, several conventional dicarboxylic acids (e.g., oxalic acid, malonic acid, succinic acid, adipic acid and glutaric acid) are selected to modify electrically conductive adhesives (ECAs) filled with micro-sized silver flakes, and s
Publikováno v:
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
In order to adapt the harsh service condition of the interconnects between the power semiconductors (chips) and substrates, there is an urgent need to develop alternative interconnect materials. Hybrid silver pastes consisting of microscale Ag flakes
Publikováno v:
The 19th International Conference on Industrial Engineering and Engineering Management ISBN: 9783642384325
Xijiang gold waterway has a very important strategic position and resource advantage. However, its development still exists different level of problem, especially the industrial spatial layout is unreasonable, its potentiality cannot be played well,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bfed7c939b63fc80baa0b36a6f368842
https://doi.org/10.1007/978-3-642-38433-2_25
https://doi.org/10.1007/978-3-642-38433-2_25
Autor:
Wang, Guang-Yue1,2, Zhu, Jing-Fei3, Wang, Qi-Chao1, Qin, Jia-Xin2,4, Wang, Xin-Lei2,4, Liu, Xing2,4, Liu, Xin-Yu2,4, Chen, Jun-Zhi2,4, Zhu, Jie-Fei5, Zhuo, Shi-Chao5, Wu, Di5, Li, Na6, Chao, Liu7,8, Meng, Fan-Lai9, Lu, Hao10, Shi, Zhen-Duo2,4,7,10, Jia, Zhi-Gang3 zhgjia@jsnu.edu.cn, Han, Cong-Hui2,4,7,10 hanconghuidoctor@vip.qq.com
Publikováno v:
Scientific Reports. 8/15/2024, Vol. 14 Issue 1, p1-11. 11p.
Autor:
Shi, Zhen‐Duo1,2,3,4 (AUTHOR), Sun, Zhuo5 (AUTHOR), Zhu, Zuo‐Bin6 (AUTHOR), Liu, Xing1 (AUTHOR), Chen, Jun‐Zhi1 (AUTHOR), Hao, Lin1 (AUTHOR), Zhu, Jie‐Fei7 (AUTHOR), Pang, Kun1 (AUTHOR), Wu, Di7 (AUTHOR), Dong, Yang1 (AUTHOR), Liu, Yu‐Fei8 (AUTHOR), Chen, Wei‐Hua9 (AUTHOR), Liang, Qing1 (AUTHOR), Zhuo, Shi‐Chao7 (AUTHOR), Han, Cong‐Hui1,2,3 (AUTHOR) hanchdoctor@st.btbu.edu.cn
Publikováno v:
Clinical & Translational Medicine. Jul2023, Vol. 13 Issue 7, p1-18. 18p.
Autor:
Wong, Lynn Yuqing1 (AUTHOR) lynnwong@bridginggenerations.com
Publikováno v:
Religions. Mar2023, Vol. 14 Issue 3, p406. 23p.
The International Conference on Industrial Engineering and Engineering Management is sponsored by the Chinese Industrial Engineering Institution, CMES, which is the only national-level academic society for Industrial Engineering. The conference is he