Výsledky vyhledávání - "Jie-Chi Chen"

Communication—Defect-Free Filling of High Aspect Ratio Through Vias in Ultrathin Glass

Autor: Jie-Chi Chen, Meng-Chi Huang, Prantik Mazumder, Pei-Lien Tseng, Scott Pollard, Hung-Yi Lin, Yiu-Hsiang Chang, Jen-Chieh Lin

Publikováno v: Journal of The Electrochemical Society. 166:D3155-D3157

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::fbae8aa5be1e7a7a8897c38eac04f009
https://doi.org/10.1149/2.0181901jes

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A novel fabrication process and measurement results of a 28GHz glass antenna with single TGV for 5G communication applications

Autor: Wei-Yu Li, Wei Chung, Meng-Chi Huang, Hou-Tzu Huang, Chia-Hsuan Wang, Po-Tsung Boris Shih, Jie-Chi Chen, Hung-Yi Lin, Anthony Ng'oma, Chieh Yang, Cheolbok Kim, Yiu-Hsiang Chang

Publikováno v: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).

Next generation 5G millimeter wave (mmWave) communications systems have recently generated a slew of novel device designs and fabrication approaches [1–2]. mmWave antenna on glass substrate with through-glass-vias (TGVs) structure is one of the pro

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::45eaa2d0c01c60f112fb94ad89533e68
https://doi.org/10.1109/impact47228.2019.9024968

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Very High Aspect Ratio (AR>10) through Glass Hole (TGH) Filling in Stagnant Condition By Using DC Plating for Advanced Interposer Applications

Autor: Yiu-Hsiang Chang, Jie-Chi Chen, Julie Tseng, James Lin, Ya-Huei Chang, Meng-Chi Huang, Hung-Yi Lin, Lu Zhang

Publikováno v: ECS Meeting Abstracts. :1139-1139

High aspect ratio (AR) through glass interposer filling has been widely investigated and developed in the recent years. Most efforts put on blind via filling by using the agitation (i.e., air agitation, cathode rotation, paddle agitation, etc.) or pe

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::ad513883dd85b3f91346078edc101ea4
https://doi.org/10.1149/ma2018-02/33/1139

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Akademický článek

Communication--Defect-Free Filling of High Aspect Ratio Through Vias in Ultrathin Glass.

Autor: Yiu-Hsiang Chang, Pei-Lien Tseng, Jen-Chieh Lin, Jie-Chi Chen, Meng-Chi Huang, Hung-Yi Lin, Pollard, Scott, Mazumder, Prantik

Publikováno v: Journal of The Electrochemical Society; 2019, Vol. 166 Issue 1, pD3155-D3157, 3p

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