Zobrazeno 1 - 10
of 39
pro vyhledávání: '"Jianyu Du"'
Autor:
Hong Xu, Jie Xing, Yuan Huang, Chen Ge, Jinghao Lu, Xu Han, Jianyu Du, Huiying Hao, Jingjing Dong, Hao Liu
Publikováno v:
Nanoscale Research Letters, Vol 14, Iss 1, Pp 1-7 (2019)
Abstract SnSe2 field-effect transistor was fabricated based on exfoliated few-layered SnSe2 flake, and its electrical and photoelectric properties have been investigated in detail. With the help of a drop of de-ionized (DI) water, the SnSe2 FET can a
Externí odkaz:
https://doaj.org/article/4ffc106619f44336926847e958dbc353
Autor:
Zihao Guo, Jinhui Liu, Xu Han, Fangyuan Ma, Dongke Rong, Jianyu Du, Yehua Yang, Tianlin Wang, Gengwei Li, Yuan Huang, Jie Xing
Publikováno v:
ACS Applied Materials & Interfaces. 15:19152-19162
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a601a61c9c67b60404e8aadf7c3fbd20
https://doi.org/10.1021/acsami.3c00417
https://doi.org/10.1021/acsami.3c00417
Publikováno v:
Lecture Notes in Electrical Engineering ISBN: 9789811938412
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5997455677826e69af9e1381e4916101
https://doi.org/10.1007/978-981-19-3842-9_57
https://doi.org/10.1007/978-981-19-3842-9_57
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15c647592d189493b2b21881a35a988b
https://doi.org/10.1109/itherm54085.2022.9899516
https://doi.org/10.1109/itherm54085.2022.9899516
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61e31f07d97a6b14dc21d8976cdf4cfd
https://doi.org/10.1109/ectc51906.2022.00284
https://doi.org/10.1109/ectc51906.2022.00284
Publikováno v:
SSRN Electronic Journal.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::437d6428a7920e9b2add44c4723623f6
https://doi.org/10.2139/ssrn.4065422
https://doi.org/10.2139/ssrn.4065422
Publikováno v:
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6466aba87f7f2ab7d6755f70ab21adf
https://doi.org/10.1109/eptc53413.2021.9663978
https://doi.org/10.1109/eptc53413.2021.9663978
Publikováno v:
Journal of Inorganic Materials. 38:378
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::38751665ea53958a69721799db36d046
https://doi.org/10.15541/jim20220699
https://doi.org/10.15541/jim20220699
Autor:
Qing Wan, Changjin Wan, Huaqiang Wu, Yuchao Yang, Xiaohe Huang, Peng Zhou, Lin Chen, Tian-Yu Wang, Yi Li, Kan-Hao Xue, Yu-Hui He, Xiang-Shui Miao, Xi Li, Chenchen Xie, Houpeng Chen, Zhitang Song, Hong Wang, Yue Hao, Junyao Zhang, Jia Huang, Zheng Yu Ren, Li Qiang Zhu, Jianyu Du, Chen Ge, Yang Liu, Guanglong Ding, Ye Zhou, Su-Ting Han, Guosheng Wang, Xiao Yu, Bing Chen, Zhufei Chu, Lunyao Wang, Yinshui Xia, Chen Mu, Feng Lin, Chixiao Chen, Bojun Cheng, Yannan Xing, Weitao Zeng, Hong Chen, Lei Yu, Giacomo Indiveri, Ning Qiao
Publikováno v:
Neuromorphic Computing and Engineering. 2:042501
The data throughput in the von Neumann architecture-based computing system is limited by its separated processing and memory structure, and the mismatching speed between the two units. As a result, it is quite difficult to improve the energy efficien
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94267c888d5945c4f11d090483f26d47
https://doi.org/10.1088/2634-4386/ac7a5a
https://doi.org/10.1088/2634-4386/ac7a5a
Autor:
Haoran Zhao, Zetian Wang, Wei Wang, Deyin Zheng, Jianyu Du, Xu Gao, Weihao Li, Yuchi Yang, Jiajie Kang
Publikováno v:
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
The heat dissipation of power amplifier (PA) chips is one of the biggest challenges in the development of miniaturized state of art glass-based high-power RF modules. Glass has excellent electrical properties, but the extremely poor thermal conductiv
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::494fac899eb7b7f7bb3fb603e4941bb0
https://doi.org/10.1109/icept52650.2021.9568212
https://doi.org/10.1109/icept52650.2021.9568212