Zobrazeno 1 - 10
of 77
pro vyhledávání: '"Jianxiu SU"'
Preliminary investigation of dry tribochemical mechanical polishing of single crystal SiC substrates
Publikováno v:
Jin'gangshi yu moliao moju gongcheng, Vol 44, Iss 1, Pp 101-108 (2024)
Aiming at the issues of low efficiency, high cost, and environmental pollution associated with silicon carbide (SiC) substrates in the polishing process, a method of tribochemical mechanical polishing of SiC substrates in the dry state (Dry Tribochem
Externí odkaz:
https://doaj.org/article/1dc6ff93096b4ce983b29d2e5cf168ae
Publikováno v:
Jin'gangshi yu moliao moju gongcheng, Vol 43, Iss 4, Pp 497-503 (2023)
To enhance the chemical mechanical polishing (CMP) efficiency of flexible display substrates, a polishing slurry based on ferric chloride and oxalic acid was proposed for polishing 304 stainless steel substrates. An orthogonal optimization test was d
Externí odkaz:
https://doaj.org/article/a6322fd759ab49af849b9749f800ed77
Publikováno v:
Micromachines, Vol 14, Iss 4, p 891 (2023)
Abrasive water jetting is an effective dressing method for a fixed abrasive pad (FAP) and can improve FAP machining efficiency and the impact of abrasive water jet (AWJ) pressure on the dressing effect; moreover, the machining state of FAP after dres
Externí odkaz:
https://doaj.org/article/423ed00adad9441283c070c4b17dc820
Publikováno v:
Machines, Vol 10, Iss 11, p 999 (2022)
Chemical mechanical polishing (CMP) technology is one of the key technologies to realize the global planarization of semiconductor wafer surfaces. With the increasing popularity and universality of its application, more and higher requirements are pu
Externí odkaz:
https://doaj.org/article/0e0ddf6b54424479adfec45f8ddca97e
Publikováno v:
Micromachines, Vol 13, Iss 7, p 981 (2022)
The surface condition of the fixed abrasive pad (FAP) has a significant impact on its machining performance, workpiece material removal rate (MRR), and surface roughness. To clarify the wavelet packet energy characteristics of friction signal under d
Externí odkaz:
https://doaj.org/article/28da3c1c21e04461a242e7b8f8d573ff
Publikováno v:
Micromachines, Vol 12, Iss 12, p 1547 (2021)
Na2CO3—1.5 H2O2, KClO3, KMnO4, KIO3, and NaOH were selected for dry polishing tests with a 6H-SiC single crystal substrate on a polyurethane polishing pad. The research results showed that all the solid-phase oxidants, except NaOH, could decompose
Externí odkaz:
https://doaj.org/article/c7a8a111635841a18f6074b2dc0b5538
Publikováno v:
Micromachines, Vol 11, Iss 5, p 494 (2020)
Micro-end-milling is a cutting technology that removes redundant material from machined workpieces by small-diameter end mills, and is widely used to manufacture miniature complex parts. During micro-end-milling, the cutting vibration caused by weak
Externí odkaz:
https://doaj.org/article/55e134736e7241f595da41bc13808038
Publikováno v:
Science Progress (1933-), 2020 Jan 01. 103(4), 1-18.
Externí odkaz:
https://www.jstor.org/stable/27042935
Autor:
Zhankui, Wang, Minghua, Pang, Mingchao, Liang, Jianbin, Wang, Lijie, Ma, Haixu, Liu, Jianhai, Han, Yongwei, Zhu, Jianxiu, Su
Publikováno v:
In Journal of Manufacturing Processes August 2021 68 Part A:141-153
Publikováno v:
In International Journal of Electrochemical Science April 2017 12(4):3385-3397