Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Jiann-Jenn Wang"'
Autor:
Chih-Chyau Yang, Chin-Long Wey, Chun-Ming Huang, Chi-Shi Chen, Shih-Lun Chen, Jiann-Jenn Wang, Chien-Ming Wu, Kuen-Jong Lee
Publikováno v:
IEEE Transactions on Industrial Electronics. 58:830-838
This paper presents a programmable system-on-chip (SoC) design methodology which integrates multiple heterogeneous SoC design projects into a single chip such that the total silicon prototyping cost for these projects can be greatly reduced by sharin
Autor:
Shih-Lun Chen, Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Jin-Ju Chue, Chi-Shi Chen, Jiann-Jenn Wang, Tzi-Dar Chiueh
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2011:002135-002159
This paper presents a thermal analysis result for a novel 3D heterogeneous integrated platform MorPack (morphing package). The MorPack platform is stacked by heterogeneous sub-modules composed of bare dies, a substrate, connection bridges, and solder
Autor:
Chi-Shi Chen, Chin-Long Wey, Chun-Ming Huang, Chih-Chyau Yang, Wei-De Chien, Shih-Lun Chen, Chien-Ming Wu, Jiann-Jenn Wang
Publikováno v:
ISCAS
A silicon prototyping methodology is presented for Multi-Project System-on-a-Chip (MP-SoC) implementation. A multi-projects platform was created for integrating heterogeneous SoC projects into a single chip. The total silicon prototyping cost of thes
Publikováno v:
2002 IEEE International Conference on Field-Programmable Technology, 2002. (FPT). Proceedings; 2002, p445-448, 4p
Publikováno v:
1993 IEEE International Symposium on Circuits and Systems.
Publikováno v:
MSE
Due to the trend of SOC/IP, design environments of SOC/IP including the system level simulation, hardware software co-simulation, hardware implementation, hardware software co-verification, and rapid prototyping are needed for education and research.
Autor:
Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Wei-De Chien, Shih-Lun Chen, Chi-Shi Chen, Jiann-Jenn Wang, Chin-Long Wey
Publikováno v:
2009 IEEE International Symposium on Circuits & Systems; 2009, p2321-2324, 4p
Publikováno v:
Proceedings 2003 IEEE International Conference on Microelectronic Systems Education. MSE'03; 2003, p150-151, 2p
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