Zobrazeno 1 - 10
of 57
pro vyhledávání: '"Jianglei Fan"'
Autor:
Jianglei Fan, Jiaojiao Wang, Xiao Wang, Zhanyun Liu, Shen Wu, Yan Wang, Ying Li, Xiangkui Zhou, Shizhong Wei
Publikováno v:
Journal of Materials Research and Technology, Vol 29, Iss , Pp 2585-2596 (2024)
Improving mechanical properties of solder alloy can result in a decrease of its conductivity. The decrease in conductivity of the solder increases the generation of Joule heat and reduces the reliability of the joint. This problem can be solved by ad
Externí odkaz:
https://doaj.org/article/71ccc14620dd4cfe9d81e49713442696
Publikováno v:
JOM. 74:4806-4816
Publikováno v:
Journal of Materials Engineering and Performance. 31:10378-10392
Publikováno v:
Tribology Transactions; Nov/Dec2023, Vol. 66 Issue 6, p1019-1025, 7p
Publikováno v:
Lecture Notes on Data Engineering and Communications Technologies ISBN: 9783031288920
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fa7212f5d21d28e6795c9e7aa709fd8
https://doi.org/10.1007/978-3-031-28893-7_45
https://doi.org/10.1007/978-3-031-28893-7_45
Publikováno v:
International Journal of Metalcasting. 16:622-633
In this paper, the lamellar orientation control and mechanical properties of directionally solidified (DS) Ti-49Al (at%) alloy in oxide ceramic crucible were investigated. Based on the nucleation undercooling theory, the feasible solidification param
Publikováno v:
Materials Science and Technology. 37:772-784
For full-lamellar TiAl alloys, mechanical properties can be improved in a wide range of temperature by controlling lamellar orientation parallel to growth direction. However, lamellar controlled Ti...
Publikováno v:
Journal of Materials Engineering and Performance. 29:4934-4943
Sn-Cu based solders have been widely investigated due to their good mechanical properties, good fluidity, narrow melting range, environmental friendliness, and low price. In this paper, the effect of Ni content on the microstructure, mechanical prope
Autor:
Gao Hongxia, Yan Wang, Hengtao Zhai, Ying Li, Jianglei Fan, Jianxiu Liu, Xiao Wang, Xiangkui Zhou, Zhanyun Liu
Publikováno v:
Journal of Electronic Materials. 49:2660-2668
The effect of Co addition (0.5-2.0 wt.%) on the microstructure evolution, thermal and mechanical property of Sn-0.7Cu (wt.%) solder was investigated. The microstructure of Sn-Cu alloy was refined with the addition of Co, and CoSn2 phase formed during
Publikováno v:
Journal of Materials Science. 55:4065-4072
A new type of Fe–Ni ceramet inert anode with the NiO contents of 0, 10, 20 and 30 wt% for aluminum electrolysis was prepared by the powder metallurgy process. The effects of NiO addition on the high-temperature oxidation and corrosion behaviors of