Zobrazeno 1 - 10
of 395
pro vyhledávání: '"Jiang, Tengfei"'
Publikováno v:
AMC 2015 – Advanced Metallization Conference
In this paper, processing effects of electroplating and post- plating annealing on via extrusion are investigated. The study is based on two TSV structures with identical geometry but different processing conditions. Via extrusion, stress and materia
Publikováno v:
AMC 2015 – Advanced Metallization Conference
In this paper, processing effects of electroplating and post- plating annealing on via extrusion are investigated. The study is based on two TSV structures with identical geometry but different processing conditions. Via extrusion, stress and materia
Publikováno v:
Shanghai Jiaotong Daxue xuebao. Yixue ban, Vol 44, Iss 1, Pp 43-49 (2024)
Objective·To evaluate the effects of anterior maxillary segmental distraction osteogenesis (AMSDO) in treating sagittal maxillary hypoplasia in cleft lip and palate (CLP) patients and to report a 3D-printed surgical guide to facilitate the osteotomy
Externí odkaz:
https://doaj.org/article/f72c45988ef243aaa90368eba460c408
Autor:
Wang, Xingyun, Zhang, Yihan, Jia, Dailing, Wei, Jingying, Hou, Dongfen, Tian, Jingqi, Jiang, Tengfei
Publikováno v:
In Journal of Alloys and Compounds 5 August 2024 994
Publikováno v:
In Journal of Colloid And Interface Science August 2024 667:128-135
Publikováno v:
In Case Studies in Construction Materials December 2023 19
Autor:
Yuan, Peilong, Zhang, Baodong, Yang, Yongtai, Jiang, Tengfei, Li, Jie, Qiu, Junling, He, Haijun
Publikováno v:
In Case Studies in Construction Materials December 2023 19
In this work, we investigated the effect of pitch distance on the statistical variation and morphology of extrusion in Cu TSVs and the underlying mechanisms. Extrusion statistics were obtained from TSV samples with two different pitch distances. A no
Externí odkaz:
http://arxiv.org/abs/2009.12388
In this paper, we utilize deep convolutional neural networks (CNNs) to classify the morphology of through-silicon via (TSV) extrusion in three dimensional (3D) integrated circuits (ICs). TSV extrusion is a crucial reliability concern which can deform
Externí odkaz:
http://arxiv.org/abs/2009.10692
Publikováno v:
In Journal of Alloys and Compounds 15 October 2023 960