Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Jian-Chun Liu"'
Publikováno v:
Corrosion Science. 140:40-50
Corrosion mechanism of Zn-30Sn high-temperature, lead-free solder in neutral 0.5 M NaCl solution are investigated by using FE-SEM, XRD, XPS and SIMS. The results confirm that α-Zn phases are corroded preferentially. Moreover, during initial corrosio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::94545627d9c8f4becdbcc98d5ed1ff05
https://doi.org/10.1016/j.corsci.2018.06.025
https://doi.org/10.1016/j.corsci.2018.06.025
Autor:
Gong Zhang, Jian‐Chun Liu
Publikováno v:
Materials and Corrosion. 69:781-792
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9733835808055e8d164c20e7e286aa44
https://doi.org/10.1002/maco.201709694
https://doi.org/10.1002/maco.201709694
Autor:
Jian-Chun Liu, Gong Zhang, Jing-Yang Xie, Zhenghong Wang, Qingyu Shi, Ju-Sheng Ma, Katsuaki Suganuma
Publikováno v:
Corrosion Science. 112:150-159
The corrosion behavior of ternary Sn–9Zn–0.1 X ( X = Ni, Cr, Cu and Ag) solder alloys were investigated by electrochemical techniques and surface characterization, aiming to explore the effects of intermetallic-forming elements on the corrosion r
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2463ec7d18ab6f560af6cf1a1697c25f
https://doi.org/10.1016/j.corsci.2016.07.004
https://doi.org/10.1016/j.corsci.2016.07.004
Autor:
Jian-Chun Liu, Chuantong Chen, Gong Zhang, Katsuaki Suganuma, Zhenghong Wang, Shenbo Zeng, Zelin Yang
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
Electrochemical measurements were employed to study the effect of temperature on the electrochemical corrosion of Zn-30Sn in neutral 0.5 M NaCl solution. The corrosion products were characterized by SEM and EDXA. OCP and potentiodynamic polarization
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::518bc4fe75f921b86668cc53383eb62b
https://doi.org/10.1109/icept.2018.8480667
https://doi.org/10.1109/icept.2018.8480667
Publikováno v:
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).
The diffusion behavior of Zn in Sn-8Zn-3Bi solder joints was investigated during long-time aging at 160 °C. Intermetallic compounds (IMCs) were formed at the interface, which were identified as Ni-Zn. Thickness of the IMCs layer increased whereas th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bf54bc325410ec31080fb9ac6cd8aef9
https://doi.org/10.1109/edaps.2017.8277008
https://doi.org/10.1109/edaps.2017.8277008
Publikováno v:
Materials & Design, Vol 84, Iss, Pp 331-339 (2015)
The effect of indium (In) addition on thermal property, microstructure, wettability and interfacial reactions of Sn–8Zn–3Bi lead-free solder alloys has been investigated. Results showed that addition of In could lower both solidus and liquidus te
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c4374926f32ed6be25de21fff3dac87c
http://www.sciencedirect.com/science/article/pii/S026412751530037X
http://www.sciencedirect.com/science/article/pii/S026412751530037X
Publikováno v:
Materials and Corrosion. 67:522-530
The corrosion products formed on Sn–Zn solder alloys were systematically studied to elucidate the corrosion mechanism of Sn–Zn alloys in chloride-containing solution. Sn–Zn alloys were subjected to immersion and polarization treatment in a 0.5
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d104408ef7e21f0d8539a3a1168bab1
https://doi.org/10.1002/maco.201508605
https://doi.org/10.1002/maco.201508605
Publikováno v:
Journal of Alloys and Compounds. 644:113-118
The effect of trace addition of Ti on the corrosion behavior of Sn–9Zn (wt.%) solder alloy in NaCl solution was investigated using polarization and electrochemical impedance spectroscopy techniques. It is found that the corrosion resistance of Sn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::65cb6eb46ed5ac9270169664154c25dd
https://doi.org/10.1016/j.jallcom.2015.04.168
https://doi.org/10.1016/j.jallcom.2015.04.168
Autor:
Gong Zhang, Masaya Nogi, Jian-Chun Liu, Shijo Nagao, S. W. Park, Hirotaka Koga, Ju-Sheng Ma, Katsuaki Suganuma
Publikováno v:
Corrosion Science. 92:263-271
Electrochemical corrosion behavior of Sn–Zn solder alloys in aerated and quiescent 0.5 M NaCl solution was investigated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization techniques, aiming to assess the role of Zn pre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08b071928bd9a31a533aa5aaf9f816ba
https://doi.org/10.1016/j.corsci.2014.12.014
https://doi.org/10.1016/j.corsci.2014.12.014
Publikováno v:
Applied Mechanics and Materials. 680:97-101
In order to weld the skin and skeleton of bus roof, it analysis the welding process of bus Outer Roof-panels , and specify the weld area and solder joint distance of outer roof-panel firstly , then built a single-sided double-point resistance welding
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::43b746ee3ce4358d998c9c1c0a25838e
https://doi.org/10.4028/www.scientific.net/amm.680.97
https://doi.org/10.4028/www.scientific.net/amm.680.97