Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Jia-Fa CHEN"'
Autor:
Jia-fa Chen, 陳家發
103
Surface passivation and antireflection strongly affect the conversion efficiency of back-contact CMOS photovoltaic devices. Enhanced device performance is obtained by reducing the surface reflection and the minority carrier recombination. In
Surface passivation and antireflection strongly affect the conversion efficiency of back-contact CMOS photovoltaic devices. Enhanced device performance is obtained by reducing the surface reflection and the minority carrier recombination. In
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/69274025247103232399
Autor:
Jing XU, Jing-Yang GAO, Cheng-Cheng LI, Yun-Xia SONG, Chao-Pei DONG, Zhao WANG, Yun-Meng LI, Yi-Fan LUAN, Jia-Fa CHEN, Zi-Jian ZHOU, Jian-Yu WU
Publikováno v:
Acta Agronomica Sinica. 48:851-859
Autor:
Meng-Syuan Cai, Jia-Fa Chen, Hsiu-Wei Su, Poki Chen, Yung-Jr Hung, Chih-Cheng Shih, Po-Chang Jen, Ting-Chang Chang
Publikováno v:
IEEE Journal of Photovoltaics. 8:342-347
In this study, we demonstrate a complementary metal–oxide–semiconductor (CMOS) backside-illuminated photovoltaic (PV) module. Fabrication of the module involves localized substrate removal from a CMOS PV chip, the application of antireflective si
Publikováno v:
IEEE Electron Device Letters. 36:1169-1171
A backside-illuminated deep-n-well-assisted CMOS photovoltaic device with a thinned substrate and an antireflective surface is demonstrated to improve the photocurrent collection efficiency from the low-lifetime bulk. The deep-n-well layer in a stand
Publikováno v:
IEEE Electron Device Letters. 36:478-480
Improved performance in CMOS interdigitated back-contact photovoltaic devices (IBC-PVs) is demonstrated by utilizing interdigitated junctions and a back metal reflector to simultaneously achieve large total junction area, uniform series resistance, a
Publikováno v:
2015 International Symposium on Next-Generation Electronics (ISNE).
Enhanced photocurrent generation in CMOS back-contact photovoltaic devices is experimentally demonstrated in this work by utilizing multilevel metals in standard bulk CMOS to simultaneously achieve uniform series resistance of devices and high optica