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pro vyhledávání: '"Jia Yunn Ting"'
Publikováno v:
2018 19th International Conference on Electronic Packaging Technology (ICEPT).
As the high demand of high power and high current in power discrete packages, products are applying the bigger die size but are limited by the same package footprint. The bigger die size requires bigger exposed pad(e-pad) size but limited by given fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3af851a1ad57336225239f2224771277
https://doi.org/10.1109/icept.2018.8480692
https://doi.org/10.1109/icept.2018.8480692
