Zobrazeno 1 - 10
of 42
pro vyhledávání: '"Jia, Hongyang"'
Autor:
Chen, Chao, Wang, Chen, Xu, Zhiheng, Bian, Mingxin, Jia, Hongyang, Cai, Ting, Liu, Yunpeng, Tang, Xiaobin
Publikováno v:
In Applied Thermal Engineering 15 January 2025 258 Part C
Publikováno v:
In Applied Thermal Engineering 1 January 2025 258 Part B
Autor:
Chen, Wenhui, Zheng, Hongxiang, Liao, Qiulan, Zeng, Shiqi, Bai, Rui, Shi, Jun, Jiang, Yunxia, Wang, Ting, Jia, Hongyang, Liang, Wei, Du, Wei, Chen, Haiqing
Publikováno v:
In Phytomedicine 25 July 2024 130
Publikováno v:
In Journal of Alloys and Compounds 5 March 2024 976
Publikováno v:
IEEE Journal of Solid-State Circuits, vol. 55, no. 9, pp. 2609-2621, Sept. 2020
This paper presents a programmable in-memory-computing processor, demonstrated in a 65nm CMOS technology. For data-centric workloads, such as deep neural networks, data movement often dominates when implemented with today's computing architectures. T
Externí odkaz:
http://arxiv.org/abs/1811.04047
Autor:
Wu, Tongda, Lei, Luchang, He, Yifan, Jia, Wenbin, Yu, Songming, Huang, Yuxuan, Jia, Hongyang, Yang, Huazhong, Liu, Yongpan
Publikováno v:
Circuits and Systems II: Express Briefs, IEEE Transactions on; November 2024, Vol. 71 Issue: 11 p4753-4757, 5p
Publikováno v:
IEEE Transactions on Power Systems; 2024, Vol. 39 Issue: 2 p2598-2610, 13p
Publikováno v:
IEEE Transactions on Power Systems; January 2024, Vol. 39 Issue: 1 p160-171, 12p
Autor:
Yin, Guodong, Chen, Yiming, Zhou, Mufeng, Tang, Wenjun, Lee, Mingyen, Yang, Zekun, Liao, Tianyu, Du, Xirui, Narayanan, Vijaykrishnan, Yang, Huazhong, Jia, Hongyang, Liu, Yongpan, Li, Xueqing
Publikováno v:
IEEE Journal of Solid-State Circuits; 2024, Vol. 59 Issue: 6 p1912-1925, 14p
Increasing renewable energy penetrations bring complex feasibility and stability problems. Data-driven methods are applied in extracting and embedding these feasibility and stability rules in power system operations and planning. This paper presents
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5b409cb9e6d472f448ace45b994c982e
https://doi.org/10.36227/techrxiv.20445150.v1
https://doi.org/10.36227/techrxiv.20445150.v1